Search Results - "Farooq Mukta G" :: K.UTB vyhledávací portál

Three dimensional organic or glass interposer

by Smith Melissa A, Liu Jin, Landers William F, Schlichting Kathryn E, Farooq Mukta G, Martin Andrew J
Year of Publication 08.11.2016

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Bonded structure with enhanced adhesion strength

by ZHU HUILONG, LUO ZHIJIONG, LI ZHENGWEN, FAROOQ MUKTA G
Year of Publication 13.10.2015

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3D CHIP STACK HAVING ENCAPSULATED CHIP-IN-CHIP

by HSU LOUIS LUN, CHENG KANGGUO, FAROOQ MUKTA G
Year of Publication 01.08.2013

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Three dimensional integration and methods of through silicon via creation

by KINSER EMILY R, WISE RICHARD, YUSUFF HAKEEM, FAROOQ MUKTA G
Year of Publication 23.07.2013

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Method for simultaneously forming a through silicon via and a deep trench structure

by HSU LOUIS L, CHENG KANGGUO, FAROOQ MUKTA G
Year of Publication 23.07.2013

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Metal-contamination-free through-substrate via structure

by VOLANT RICHARD P, HANNON ROBERT, FAROOQ MUKTA G
Year of Publication 23.07.2013

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FACILITATING CHIP DICING FOR METAL-METAL BONDING AND HYBRID WAFER BONDING

by LIN WEI, KALTALIOGLU ERDEM, WINSTEL KEVIN R, SKORDAS SPYRIDON, FAROOQ MUKTA G
Year of Publication 10.09.2015

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METAL-CONTAMINATION-FREE THROUGH-SUBSTRATE VIA STRUCTURE

by VOLANT RICHARD P, HANNON ROBERT, FAROOQ MUKTA G
Year of Publication 06.06.2013

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3D multiple die stacking

by IYER SUBRAMANIAN S, HANNON ROBERT, FAROOQ MUKTA G
Year of Publication 04.06.2013

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Integrated void fill for through silicon via

by VOLANT RICHARD P, PETRARCA KEVIN S, FAROOQ MUKTA G
Year of Publication 04.06.2013

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METAL-CONTAMINATION -FREE THROUGH-SUBSTRATE VIA STRUCTURE

by HANNON, ROBERT, VOLANT, RICHARD, P, FAROOQ, MUKTA, G
Year of Publication 29.05.2013

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Soft error rate mitigation by interconnect structure

by MELVILLE IAN D, PETRARCA KEVIN S, FAROOQ MUKTA G
Year of Publication 21.05.2013

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INTEGRATED VOID FILL FOR THROUGH SILICON VIA

by VOLANT RICHARD P, PETRARCA KEVIN S, FAROOQ MUKTA G
Year of Publication 16.05.2013

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LEAKAGE MEASUREMENT OF THROUGH SILICON VIAS

by BHOOVARAGHAN, BHAVANA, SAROOP, SUDESH, KINSER, EMILY, FAROOQ, MUKTA, G
Year of Publication 10.05.2013

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Three dimensional integration and methods of through silicon via creation

by KINSER EMILY R, WISE RICHARD, YUSUFF HAKEEM, FAROOQ MUKTA G
Year of Publication 09.04.2013

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3D INTEGRATION STRUCTURE AND METHOD USING BONDED METAL PLANES

by LYER SUBRAMANIAN S, FAROOQ MUKTA G
Year of Publication 18.11.2010

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Facilitating chip dicing for metal-metal bonding and hybrid wafer bonding

by LIN WEI, KALTALIOGLU ERDEM, WINSTEL KEVIN R, SKORDAS SPYRIDON, FAROOQ MUKTA G
Year of Publication 16.06.2015

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LEAKAGE MEASUREMENT OF THROUGH SILICON VIAS

by KINSER EMILY R, SAROOP SUDESH, BHOOVARAGHAN BHAVANA, FAROOQ MUKTA G
Year of Publication 21.03.2013

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LEAKAGE MEASUREMENT OF THROUGH SILICON VIAS

by BHOOVARAGHAN, BHAVANA, SAROOP, SUDESH, KINSER, EMILY, FAROOQ, MUKTA, G
Year of Publication 21.03.2013

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FACILITATING CHIP DICING FOR METAL-METAL BONDING AND HYBRID WAFER BONDING

by LIN WEI, KALTALIOGLU ERDEM, WINSTEL KEVIN R, SKORDAS SPYRIDON, FAROOQ MUKTA G
Year of Publication 04.06.2015

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