High-performance large-inductance embedded inductors in thin array plastic packaging (TAPP) for RF system-in-package applications
Chen, K.J., Kwok Wai Chan, Wong, M.K.W., Fok, N.M.K., Kwan, K.K.P., Fan, N.C.H.
Published in IEEE microwave and wireless components letters (01.09.2004)
Published in IEEE microwave and wireless components letters (01.09.2004)
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