Novel Strain Release Self-Assembly Design of Silver Nanowires and Application in Flexible Strain Sensors
Chen, Yen Shuo, Ko, Yu Chien, Fan, Hua Tai, Lin, Ching Chang, Ko, Fu Hsiang
Published in 2023 IEEE Nanotechnology Materials and Devices Conference (NMDC) (22.10.2023)
Published in 2023 IEEE Nanotechnology Materials and Devices Conference (NMDC) (22.10.2023)
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Conference Proceeding
Novel Single and Co-Ion Implantation Induced Backside Etch Stop Structures for 3D Multilayer Stacked Package
Chen, Yen-Shuo, Chiu, Tzu-Wei, Fan, Hua-Tai, Ko, Yu-Chien, Chen, Chu-Chi, Ko, Fu-Hsiang
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
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Conference Proceeding
Carbon/Nitrogen Dual-Doped in P-Type Silicon Hard Mask for Wafer Thinning and Dishing Less for Hybrid Bonding
Chen, Yen-Shuo, Chiu, Tzu Wei, Fan, Hua-Tai, Ko, Yu-Chien, Chen, Chu Chi, Ko, Fu-Hsiang
Published in 2024 International Conference on Electronics Packaging (ICEP) (17.04.2024)
Published in 2024 International Conference on Electronics Packaging (ICEP) (17.04.2024)
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Conference Proceeding
Alignment and Transfer of Silver Nanowire Arrays onto Unconventional Substrates for Optoelectronic Devices via Dielectrophoresis Force
Chen, Yen-Shuo, Liu, Shun-Yu, Lin, Ching-Chang, Fan, Hua-Tai, Ko, Yu-Chien, Chen, Chun-Chi, Ko, Fu-Hsiang
Published in 2024 International Conference on Electronics Packaging (ICEP) (17.04.2024)
Published in 2024 International Conference on Electronics Packaging (ICEP) (17.04.2024)
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Conference Proceeding
Boron Ion Implantation-Induced Embedded Layers for Ultra-Thin Die Structures
Chen, Yen Shuo, Chiu, Tzu Wei, Ko, Yu Chien, Fan, Hua Tai, Huang, Yi Cheng, Ko, Fu Hsiang
Published in 2023 IEEE Nanotechnology Materials and Devices Conference (NMDC) (22.10.2023)
Published in 2023 IEEE Nanotechnology Materials and Devices Conference (NMDC) (22.10.2023)
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Conference Proceeding