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Published in Tetrahedron letters (28.03.2019)
Published in Tetrahedron letters (28.03.2019)
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Year of Publication 28.03.2023
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Year of Publication 14.12.2021
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Year of Publication 12.10.2022
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Organometallic adduct compounds and method of manufacturing integrated circuit device using the same
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Year of Publication 28.09.2021
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Year of Publication 27.09.2021
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Niobium compound and method of forming thin film
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Year of Publication 17.02.2021
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Year of Publication 11.10.2022
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ORGANOMETALLIC ADDUCT COMPOUND AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE BY USING THE SAME
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Year of Publication 13.10.2022
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Year of Publication 13.10.2022
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NIOBIUM COMPOUND AND METHOD OF FORMING THIN FILM
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Year of Publication 11.02.2021
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Year of Publication 11.02.2021
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ORGANOMETALLIC COMPOUND AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT USING THE SAME
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Year of Publication 16.12.2021
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Year of Publication 16.12.2021
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MATERIALS FOR FABRICATING THIN FILMS, METHODS OF FABRICATING THIN FILMS USING THE SAME, AND EQUIPMENT FOR FABRICATING THIN FILMS USING THE SAME
Cho, Youn Joung, Manabe, Yoshiki, Koide, Takanori, Uchiuzou, Hiroyuki, Ryu, Seung-Min, Park, Gyu-Hee, Aoki, Yutaro, Saito, Kazuya, Harano, Kazuki, Fuse, Wakana
Year of Publication 09.12.2021
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Year of Publication 09.12.2021
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Organometallic adduct compound and method of manufacturing integrated circuit device by using the same
SAITO, KAZUYA, KIM, YOUN-SOO, FUSE, WAKANA, KOIDE, TAKANORI, CHO, YOUN-JOUNG, RYU, SEUNG-MIN, KIM, JAE-WOON, HARANO, KAZUKI, KIMURA, MASAYUKI, AOKI, YUTARO, YOSHII, TAKAHIRO, MANABE, YOSHIKI, PARK, GYU-HEE, UCHIUZOU, HIROYUKI
Year of Publication 16.06.2023
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Year of Publication 16.06.2023
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