Demonstration of inter-chip data transmission in a three-dimensional stacked chip fabricated by chip-level TSV integration
Hozawa, K., Furuta, F., Hanaoka, Y., Aoki, M., Osada, K., Takeda, K., Kang Wook Lee, Fukushima, T., Koyanagi, M.
Published in 2012 Symposium on VLSI Technology (VLSIT) (01.06.2012)
Published in 2012 Symposium on VLSI Technology (VLSIT) (01.06.2012)
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Conference Proceeding
HYDROGEN PRODUCTION DEVICE
HAYAKAWA JUN, TAKAHASHI HIROMASA, FURUTA FUTOSHI, FUKATANI NAOTO, YABUUCHI MAKOTO
Year of Publication 11.04.2023
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Year of Publication 11.04.2023
Patent