High-Performance HfO2/Al2O3 Superlattice MIM Capacitor in a 200 mm High-Volume Batch-ALD Platform
Mukhopadhyay, Partha, Fletcher, Ivan, Couvertier, Zuriel C., Morris, Julio, Perez, Jennifer, Nichols, Chris, Allgair, John, Vandevere, Jim, Schoenfeld, Winston V., Aoki, Sara, Novoselic, Enzo, Lombardo, Shara, Triyoso, Dina, Kretzschmar, Jon, deVilliers, Anton, Fulford, Jim
Published in IEEE transactions on electron devices (01.03.2024)
Published in IEEE transactions on electron devices (01.03.2024)
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Journal Article
High-Performance HfO$_{\text{2}}$/Al$_{\text{2}}$O$_{\text{3}}$ Superlattice MIM Capacitor in a 200 mm High-Volume Batch-ALD Platform
Mukhopadhyay, Partha, Fletcher, Ivan, Couvertier, Zuriel C., Morris, Julio, Perez, Jennifer, Nichols, Chris, Allgair, John, Vandevere, Jim, Schoenfeld, Winston V., Aoki, Sara, Novoselic, Enzo, Lombardo, Shara, Triyoso, Dina, Kretzschmar, Jon, deVilliers, Anton, Fulford, Jim
Published in IEEE transactions on electron devices (2024)
Published in IEEE transactions on electron devices (2024)
Get full text
Journal Article
Influence of Heat Treatment on the Quality of Die-to-Wafer Hybrid Bond Interconnects
Wenzel, Laura, Rudolph, Catharina, Shehzad, Adil, Mukhopadhyay, Partha, Fulford, H. Jim, Junghaehnel, Manuela, Panchenko, Juliana
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
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Conference Proceeding
Annealing Effects in Sub-8 μm Pitch Die-to-Wafer Hybrid Bonding
Mukhopadhyay, Partha, Wenzel, Laura, Rudolph, Catharina, Tuchman, Andrew, Ryan, Kevin, Gildea, Adam, Nichols, Chris, Allgair, John, Arkalgud, Sitaram, deVilliers, Anton, Fulford, Jim
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
Get full text
Conference Proceeding