Search Results - "FUKUMITSU Kenshi" :: K.UTB vyhledávací portál

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A method of cutting an object along two different directions further using an elastic sheet for dividing the object

by FUKUYO, FUMITSUGU, UCHIYAMA, NAOKI, FUKUMITSU, KENSHI, WAKUDA, TOSHIMITSU
Year of Publication 17.11.2010

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Method for cutting semiconductor substrate

by SUGIURA, RYUJI, FUKUYO, FUMITSUGU, UCHIYAMA, NAOKI, FUKUMITSU, KENSHI
Year of Publication 10.11.2010

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Laser processing method and laser processing apparatus

by Fukuyo, Fumitsugu, Fukumitsu, Kenshi, Uchiyama, Naoki, Wakuda, Toshimitsu
Year of Publication 02.11.2010

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Laser processing method and laser processing apparatus

by UCHIYAMA NAOKI, WAKUDA TOSHIMITSU, FUKUYO FUMITSUGU, FUKUMITSU KENSHI
Year of Publication 02.11.2010

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TWI464986B

by KUNO, KOJI, FUKUMITSU, KENSHI, KUMAGAI, MASAYOSHI
Year of Publication 11.12.2014

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Method for cutting semiconductor substrate

by SUGIURA, RYUJI, FUKUYO, FUMITSUGU, UCHIYAMA, NAOKI, FUKUMITSU, KENSHI
Year of Publication 13.10.2010

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Method of cutting a substrate with localisation of laser modified region near one of the surfaces of the substrate

by FUKUYO, FUMITSUGU, UCHIYAMA, NAOKI, FUKUMITSU, KENSHI, WAKUDA, TOSHIMITSU
Year of Publication 15.09.2010

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Method of cutting a substrate with forming along a line of not overlapping modified spot inside the substrate

by FUKUYO, FUMITSUGU, UCHIYAMA, NAOKI, FUKUMITSU, KENSHI, WAKUDA, TOSHIMITSU
Year of Publication 15.09.2010

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Method of processing an object with formation of three modified regions as starting point for cutting the object

by FUKUYO, FUMITSUGU, UCHIYAMA, NAOKI, FUKUMITSU, KENSHI, WAKUDA, TOSHIMITSU
Year of Publication 15.09.2010

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Method of cutting a substrate with forming along a line of overlapping modified spot inside the substrate

by FUKUYO, FUMITSUGU, UCHIYAMA, NAOKI, FUKUMITSU, KENSHI, WAKUDA, TOSHIMITSU
Year of Publication 15.09.2010

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Three-dimensional radiation position detector and method of identifying sensed positions therein

by INADAMA NAOKO, MURAYAMA HIDEO, FUKUMITSU KENSHI, OMURA TOMOHIDE, MORIYA TAKAHIRO, WATANABE MITSUO, YAMAYA TAIGA
Year of Publication 07.03.2013

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Semiconductor substrate, semiconductor chip and production method for a semiconductor device

by FUKUYO, FUMITSUGU, UCHIYAMA, NAOKI, FUKUMITSU, KENSHI
Year of Publication 11.11.2007

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Laser processing method and semiconductor chip

by SAKAMOTO TAKESHI, FUKUMITSU KENSHI
Year of Publication 26.05.2010

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A method of cutting an object along two different directions using elliptically polarised laser beam

by FUKUYO, FUMITSUGU, UCHIYAMA, NAOKI, FUKUMITSU, KENSHI, WAKUDA, TOSHIMITSU
Year of Publication 18.08.2010

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SEMICONDUCTOR SUBSTRATE CUTTING METHOD

by UCHIYAMA NAOKI, SUGIURA RYUJI, FUKUMITSU KENSHI, FUKUYO FUMITSUU, ATSUMI KAZUHIRO
Year of Publication 12.08.2010

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SUBSTRATE DIVIDING METHOD

by UCHIYAMA NAOKI, FUKUYO FUMITSUGU, FUKUMITSU KENSHI, FUJII YOSHIMARO
Year of Publication 12.08.2010

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Method of cutting semiconductor substrate

by SUGIURA, RYUJI, FUKUYO, FUMITSUGU, UCHIYAMA, NAOKI, FUKUMITSU, KENSHI
Year of Publication 11.08.2010

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Laser processing apparatus with controller for precisely positioning the focus point in the object to be processed

by FUKUYO, FUMITSUGU, UCHIYAMA, NAOKI, FUKUMITSU, KENSHI, WAKUDA, TOSHIMITSU
Year of Publication 04.08.2010

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Laser processing apparatus with controller for positioning the focus point at different levels in the object to be processed

by FUKUYO, FUMITSUGU, UCHIYAMA, NAOKI, FUKUMITSU, KENSHI, WAKUDA, TOSHIMITSU
Year of Publication 21.07.2010

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Laser processing apparatus and method with focusing adjustments achieved with low laser power output

by FUKUYO, FUMITSUGU, UCHIYAMA, NAOKI, FUKUMITSU, KENSHI, WAKUDA, TOSHIMITSU
Year of Publication 21.07.2010

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