Electromigration failure analysis of flip-chip solder joint by using void growth simulation and synchrotron radiation X-ray microtomography
Tanie, Hisashi, Fujiwara, Shinichi, Chiwata, Nobuhiko, Fujiyoshi, Masaru, Shintani, Hiroshi, Harubeppu, Yu
Published in 2012 4th Electronic System-Integration Technology Conference (01.09.2012)
Published in 2012 4th Electronic System-Integration Technology Conference (01.09.2012)
Get full text
Conference Proceeding
SOLDER BALL AND SEMICONDUCTOR DEVICE USING SOLDER BALL
FUJIWARA SHINICHI, IKEDA YASUSHI, CHIWATA NOBUHIKO, WAKANO MOTOKI, FUJIYOSHI MASARU
Year of Publication 14.02.2013
Get full text
Year of Publication 14.02.2013
Patent
SEMICONDUCTOR DEVICE, ELECTRONIC COMPONENT USING THE SAME, AND METHOD OF MANUFACTURING THEM
TANIE HISAFUMI, FUJIWARA SHINICHI, CHIWATA NOBUHIKO, WAKANO MOTOKI, FUJIYOSHI MASARU
Year of Publication 24.05.2012
Get full text
Year of Publication 24.05.2012
Patent