Search Results - "FUJIWARA, HIDEMICHI" :: K.UTB vyhledávací portál

Effect of Poly(N-vinyl-pyrrolidone) on Electrochemical Production of Cu Nanoparticles

by Saito, Mikiko, Ishii, Tomohiro, Fujiwara, Hidemichi, Homma, Takayuki
Published in Journal of the Electrochemical Society (01.01.2018)

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JOINT MATERIAL OF ALUMINUM-CONTAINING MEMBER AND JOINT STRUCTURE USING SAID JOINT MATERIAL

by FUJIWARA HIDEMICHI
Year of Publication 15.04.2021

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Patent

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JOINING MATERIAL COMPOSITION, METHOD FOR PRODUCING JOINING MATERIAL COMPOSITION, JOINING FILM, METHOD FOR MANUFACTURING JOINED BODY, AND JOINED BODY

by NITTA NORZAFRIZA, FUJIWARA HIDEMICHI
Year of Publication 31.08.2023

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BONDING MATERIAL COMPOSITION, METHOD FOR MANUFACTURING BONDING MATERIAL COMPOSITION, BONDING FILM, METHOD FOR MANUFACTURING BONDED BODY, AND BONDED BODY

by NITTA, Norzafriza, FUJIWARA, Hidemichi
Year of Publication 24.08.2023

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Preparation of Electrodeposited Pt Nano Patterned Electrode using UV-Nano Imprinting Lithography

by Saito, Mikiko, Mizuno, Jun, Nishikubo, Hideo, Fujiwara, Hidemichi, Homma, Takayuki
Published in ECS transactions (20.03.2009)

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METAL PARTICLE MIXED DISPERSION, PRODUCTION METHOD OF METAL PARTICLE MIXED DISPERSION, POLYMER ATTACHED METAL PARTICLES USED IN METAL PARTICLE MIXED DISPERSION, AND SEMICONDUCTOR DEVICE FORMED WITH METAL PARTICLE DISPERSION

by ISHII TOMOHIRO, FUJIWARA HIDEMICHI
Year of Publication 07.05.2020

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Patent

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SURFACE-COATED METAL FINE PARTICLE AND DISPERSION SOLUTION THEREOF

by ISHII TOMOHIRO, FUJIWARA HIDEMICHI
Year of Publication 19.12.2019

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METALLIC FINE PARTICLE-CONTAINING COMPOSITION

by ISHII TOMOHIRO, FUJIWARA HIDEMICHI
Year of Publication 18.04.2019

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MATERIAL FOR JOINING METAL, AND JUNCTION STRUCTURE

by SATO YOSHIHIRO, FUJIWARA HIDEMICHI
Year of Publication 19.07.2018

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HEAT BONDING MATERIAL AND MANUFACTURING METHOD OF ELECTRIC AND ELECTRONIC EQUIPMENT

by NITTA NORZAFRIZA, FUJIWARA HIDEMICHI
Year of Publication 05.07.2018

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Patent

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BONDING FILM AND TAPE FOR WAFER PROCESSING

by NITTA, Norzafriza, FUJIWARA, Hidemichi
Year of Publication 28.06.2018

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Patent

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SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR DEVICE

by SATO YOSHIHIRO, FUJIWARA HIDEMICHI
Year of Publication 22.02.2018

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COMPOSITION CONTAINING METAL PARTICLES

by ISHII Tomohiro, FUJIWARA Hidemichi
Year of Publication 08.02.2018

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Patent

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METAL MATERIAL FOR FOIL YARN AND FOIL YARN AS WELL AS TWIST YARN AND CLOTH FORMED WITH FOIL YARN

by KANEKO HIROSHI, OGIWARA YOSHIAKI, MIYAZAKI KAHO, FUJIWARA HIDEMICHI
Year of Publication 08.12.2022

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PASTE FOR METAL BONDING, BONDING MEMBER, BONDING STRUCTURE, AND MANUFACTURING METHOD OF BONDING STRUCTURE

by SATO YOSHIHIRO, NITTA NORZAFRIZA, FUJIWARA HIDEMICHI
Year of Publication 11.03.2021

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DISPERSION SOLUTION OF COPPER FINE PARTICLE AGGREGATE, MANUFACTURING METHOD OF SINTERED CONDUCTOR AND MANUFACTURING METHOD OF SINTERED CONDUCTOR JUNCTION MEMBER

by NITTA NORZAFRIZA, FUJIWARA HIDEMICHI
Year of Publication 12.10.2017

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Patent

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BONDING FILM, TAPE FOR WAFER PROCESSING, METHOD FOR PRODUCING BONDED OBJECT, AND BONDED OBJECT AND PASTED OBJECT

by NITTA, Norzafriza, SATO, Yoshihiro, FUJIWARA, Hidemichi
Year of Publication 21.01.2021

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METAL PARTICLE-CONTAINING COMPOSITION, AND CONDUCTIVE ADHESIVE FILM

by ISHII Tomohiro, FUJIWARA Hidemichi, NITTA Norzafriza
Year of Publication 24.09.2020

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Patent

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METAL FINE PARTICLE-CONTAINING COMPOSITION

by FUJIWARA, Hidemichi, ISHII, Tomohiro
Year of Publication 12.01.2017

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Patent

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JOINED BODY

by SATO YOSHIHIRO, FUJIWARA HIDEMICHI
Year of Publication 05.01.2017

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Patent

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