Adhesive composition, anisotropic conductive adhesive composition, connection material for circuit and connection body preferably free of epoxy resin-based cationic polymerization hardener and having high bonding characteristics
KUDOU, SUNAO, MORI, SATORU, MORIJIRI, TOMOKI, FUJINAWA, TOHRU, ITO, AKIHIRO
Year of Publication 01.04.2017
Get full text
Year of Publication 01.04.2017
Patent
Circuit-connecting material and circuit terminal connected structure and connecting method
Watanabe, Itsuo, Fujinawa, Tohru, Arifuku, Motohiro, Kanazawa, Houko, Kuwano, Atsushi
Year of Publication 01.02.2011
Get full text
Year of Publication 01.02.2011
Patent
Circuit-connecting material and circuit terminal connected structure and connecting method
KUWANO ATSUSHI, FUJINAWA TOHRU, ARIFUKU MOTOHIRO, KANAZAWA HOUKO, WATANABE ITSUO
Year of Publication 01.02.2011
Get full text
Year of Publication 01.02.2011
Patent
ADHESIVE FOR CIRCUIT CONNECTION, CIRCUIT CONNECTION METHOD USING THE SAME, AND CIRCUIT CONNECTED STRUCTURE
FUJINAWA TOHRU, YUSA MASAMI, KANAZAWA HOKO, ONO HIROSHI, NOMURA SATOYUKI
Year of Publication 25.11.2010
Get full text
Year of Publication 25.11.2010
Patent
ADHESIVE MATERIAL REEL
FUJINAWA TOHRU, TATSUZAWA TAKASHI, ARIFUKU MOTOHIRO, KOBAYASHI KOUJI, SEKI KOTARO, SEKI TAKASHI
Year of Publication 06.03.2013
Get full text
Year of Publication 06.03.2013
Patent
ADHESIVE COMPOSITION, CIRCUIT CONNECTING MATERIAL AND CONNECTING STRUCTURE OF CIRCUIT MEMBER
TATSUZAWA, TAKASHI, FUJINAWA, TOHRU, KOBAYASHI, KOUJI, FUKUSHIMA, NAOKI
Year of Publication 04.08.2010
Get full text
Year of Publication 04.08.2010
Patent