Semiconductor package structure having hollow chamber and bottom substrate and package process thereof
Chen Yen-Ting, Hsieh Yung-Wei, Shih Cheng-Hung, Lin Shu-Chen, Ho Fu-Yen
Year of Publication 29.11.2016
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Year of Publication 29.11.2016
Patent
PROCESS FOR MANUFACTURING SEMICONDUCTOR PACKAGE HAVING HOLLOW CHAMBER
Chen Yen-Ting, Hsieh Yung-Wei, Shih Cheng-Hung, Lin Shu-Chen, Ho Fu-Yen
Year of Publication 03.11.2016
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Year of Publication 03.11.2016
Patent