by Zhang, Zhe, Fu, Yifeng, Zhang, Zun, Lin, Xin, Qi, Jiayun, Ling, William Yeong Liang, Tang, Haibin, Herdrich, Georg
Published in Plasma sources science & technology (01.12.2021)

by Liu, Ya, Zhao, Xiaoli, Wang, Cancan, Zhang, Long, Li, MengXiong, Pan, Yunmei, Fu, Yifeng, Liu, Johan, Lu, Hongbin
Published in Journal of materials chemistry. A, Materials for energy and sustainability (2018)

by Wang, Nan, Jiang, Di, Ye, Lilei, Murugesan, Murali, Edwards, Michael, Fu, Yifeng, Liu, Johan
Published in Advanced functional materials (01.07.2015)

by Zhang, Yong, Fu, Yifeng, Edwards, Michael, Jeppson, Kjell, Ye, Lilei, Liu, Johan
Published in Materials letters (15.04.2017)

by Mu, Wei, Fu, Yifeng, Sun, Shuangxi, Edwards, Michael, Ye, Lilei, Jeppson, Kjell, Liu, Johan
Published in Chemical engineering journal (Lausanne, Switzerland : 1996) (15.11.2016)

by Jiang, Di, Wang, Nan, Edwards, Michael, Mu, Wei, Nylander, Andreas, Fu, Yifeng, Jeppson, Kjell, Liu, Johan
Published in Small (Weinheim an der Bergstrasse, Germany) (01.03.2016)

by Wei Mu, Hansson, Josef, Shuangxi Sun, Edwards, Michael, Yifeng Fu, Jeppson, Kjell, Liu, Johan
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)

by Darmawan, Christian Chandra, Lilei Ye, Samani, Majid Kabiri, Yifeng Fu, Liu, Johan
Published in 2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac) (01.06.2017)

by Johan Liu, Yifeng Fu, Di Jiang
Published in 2014 12th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT) (01.10.2014)

by Pengtu Zhang, Nan Wang, Zanden, Carl, Lilei Ye, Yifeng Fu, Liu, Johan
Published in 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) (01.05.2014)

by Guo, Sihua, Chen, Shujin, Nkansah, Amos, Zehri, Abdelhafid, Murugesan, Murali, Zhang, Yong, Zhang, Yan, Yu, Chen, Fu, Yifeng, Enmark, Markus, Chen, Jin, Wu, Xinfeng, Yu, Wei, Liu, Johan
Published in 2d materials (01.01.2023)

by Mehta, Ankit Nalin, Mu, Wei, Murugesan, Murali, Jiao, Yang, Fu, Yifeng, Hyldgaard, Per, Liu, Johan
Published in Journal of materials science. Materials in electronics (01.04.2018)

by Sun, Shuangxi, Chen, Si, Luo, Xin, Fu, Yifeng, Ye, Lilei, Liu, Johan
Published in Microelectronics and reliability (01.01.2016)

by Zhang, Yong, Zhang, Pengtu, Wang, Nan, Fu, Yifeng, Liu, Johan
Published in Proceedings of the 5th Electronics System-Integration Technology Conference, ESTC 2014 (01.09.2014)

by Yifeng Fu, Wei Mu, Shuangxi Sun, Ning Wang, Shirong Huang, Johan Liu
Published in 2016 6th Electronic System-Integration Technology Conference (ESTC) (01.09.2016)

by Mu, Wei, Sun, Shuangxi, Jiang, Di, Fu, Yifeng, Edwards, Michael, Zhang, Yong, Jeppson, Kjell, Liu, Johan
Published in Journal of electronic materials (01.08.2015)

by Shuangxi Sun, Jie Bao, Wei Mu, Yifeng Fu, Yong Zhang, Lilei Ye, Liu, Johan
Published in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) (01.05.2015)

by Liu, Ya, Zhao, Xiaoli, Wang, Cancan, Zhang, Long, Li, MengXiong, Pan, Yunmei, Fu, Yifeng, Liu, Johan, Lu, Hongbin
Year of Publication 25.09.2018

by Nylander, Andreas, Fu, Yifeng, Huang, Mingliang, Liu, Johan
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.03.2019)

by Zhaoli Gao, Yong Zhang, Yifeng Fu, Yuen, Matthew, Liu, Johan
Published in 2013 IEEE 63rd Electronic Components and Technology Conference (01.05.2013)