반도체 구조체들을 위한 금속 피처들의 BUF(Bottom-Up Fill)
HOURANI RAMI, GRIGGIO FLAVIO, GLASSMAN TIMOTHY E, CLENDENNING SCOTT B, KLOSTER GRANT M, MITAN MARTIN M, FRASURE KENT N, GSTREIN FLORIAN
Year of Publication 21.02.2018
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Year of Publication 21.02.2018
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Two-stage bake photoresist with releasable quencher
Gstrein, Florian, Krysak, Marie, Bristol, Robert L, Blackwell, James M, Frasure, Kent N
Year of Publication 09.04.2024
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Year of Publication 09.04.2024
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TWO-STAGE BAKE PHOTORESIST WITH RELEASABLE QUENCHER
FRASURE, Kent N, BRISTOL, Robert L, GSTREIN, Florian, BLACKWELL, James M, KRYSAK, Marie
Year of Publication 07.07.2022
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Year of Publication 07.07.2022
Patent
Two-stage bake photoresist with releasable quencher
Gstrein, Florian, Krysak, Marie, Bristol, Robert L, Blackwell, James M, Frasure, Kent N
Year of Publication 26.04.2022
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Year of Publication 26.04.2022
Patent
TWO-STAGE BAKE PHOTORESIST WITH RELEASABLE QUENCHER
FRASURE, Kent N, BRISTOL, Robert L, GSTREIN, Florian, BLACKWELL, James M, KRYSAK, Marie
Year of Publication 07.02.2019
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Year of Publication 07.02.2019
Patent
TWO-STAGE BAKE PHOTORESIST WITH RELEASABLE QUENCHER
FRASURE, Kent N, BRISTOL, Robert L, GSTREIN, Florian, BLACKWELL, James M, KRYSAK, Marie
Year of Publication 12.10.2017
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Year of Publication 12.10.2017
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TECHNIQUES FOR BOTTOM-UP FILLING OF THREE-DIMENSIONAL SEMICONDUCTOR DEVICE TOPOGRAPHIES
KLOSTER, Grant M, CLENDENNING, Scott B, FRASURE, Kent N, GSTREIN, Florian, HOURANI, Rami
Year of Publication 30.03.2017
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Year of Publication 30.03.2017
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BOTTOM-UP FILL (BUF) OF METAL FEATURES FOR SEMICONDUCTOR STRUCTURES
CLENDENNING, Scott B, KLOSTER, Grant M, FRASURE, Kent N, MITAN, Martin M, GLASSMAN, Timothy E, GSTREIN, Florian, GRIGGIO, Flavio, HOURANI, Rami
Year of Publication 20.02.2019
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Year of Publication 20.02.2019
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BOTTOM-UP FILL (BUF) OF METAL FEATURES FOR SEMICONDUCTOR STRUCTURES
CLENDENNING, Scott B, KLOSTER, Grant M, FRASURE, Kent N, MITAN, Martin M, GLASSMAN, Timothy E, GSTREIN, Florian, GRIGGIO, Flavio, HOURANI, Rami
Year of Publication 10.05.2018
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Year of Publication 10.05.2018
Patent
BOTTOM-UP FILL (BUF) OF METAL FEATURES FOR SEMICONDUCTOR STRUCTURES
CLENDENNING, Scott B, KLOSTER, Grant M, FRASURE, Kent N, MITAN, Martin M, GLASSMAN, Timothy E, GSTREIN, Florian, GRIGGIO, Flavio, HOURANI, Rami
Year of Publication 25.04.2018
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Year of Publication 25.04.2018
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Techniques for bottom-up filling of three-dimensional semiconductor device topographies
HOURANI, RAMI, FRASURE, KENT, KLOSTER, GRANT, GSTREIN, FLORIAN, CLENDENNING, SCOTT B
Year of Publication 01.07.2020
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Year of Publication 01.07.2020
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BOTTOM-UP FILL (BUF) OF METAL FEATURES FOR SEMICONDUCTOR STRUCTURES
CLENDENNING, Scott B, KLOSTER, Grant M, FRASURE, Kent N, MITAN, Martin M, GLASSMAN, Timothy E, GSTREIN, Florian, GRIGGIO, Flavio, HOURANI, Rami
Year of Publication 22.12.2016
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Year of Publication 22.12.2016
Patent
Techniques for bottom-up filling of three-dimensional semiconductor device topographies
HOURANI, RAMI, FRASURE, KENT, KLOSTER, GRANT, GSTREIN, FLORIAN, CLENDENNING, SCOTT B
Year of Publication 01.07.2017
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Year of Publication 01.07.2017
Patent
Bottom-up fill (BUF) of metal features for semiconductor structures
HOURANI, RAMI, FRASURE, KENT, GLASSMAN, TIMOTHY, MITAN, MARTIN M, GRIGGIO, FLAVIO, CLENDENNING, SCOTT B, KLOSTER, GRANT, GSTREIN, FLORIAN
Year of Publication 01.03.2017
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Year of Publication 01.03.2017
Patent
Bottom-up fill (BUF) of metal features for semiconductor structures
HOURANI RAMI, GRIGGIO FLAVIO, GLASSMAN TIMOTHY E, CLENDENNING SCOTT B, KLOSTER GRANT M, MITAN MARTIN M, FRASURE KENT N, GSTREIN FLORIAN
Year of Publication 27.02.2018
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Year of Publication 27.02.2018
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