Search Results - "FEUCHTINGER, ERNST" :: K.UTB vyhledávací portál

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METHOD FOR MANUFACTURING A SEMICONDUCTOR WAFER WHICH IS COATED ON ONE SIDE AND PROVIDED WITH A FINISH

by GEORG PIETSCH, ERNST FEUCHTINGER, BERND SAUTER
Year of Publication 30.04.2007

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Method and device for removing a semiconductor wafer from a flat substrate

by PIETSCH; GEORG, FEUCHTINGER; ERNST
Year of Publication 14.09.1999

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Method and device for removing a semiconductor wafer from a flat substrate

by FEUCHTINGER ERNST, PIETSCH GEORG
Year of Publication 22.02.1999

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METHOD AND DEVICE FOR ELIMINATING SEMICONDUCTOR WAFER FROM FLAT SUBSTRATE

by FEUCHTINGER ERNST, PIETSCH GEORG
Year of Publication 16.06.1998

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Method of making a single side coated and final mirror polished wafer

by FEUCHTINGER, ERNST, SAUTER, BERND, PIETSCH, GEORG
Year of Publication 12.12.2001

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METHOD FOR MANUFACTURING A SEMICONDUCTOR WAFER WHICH IS COATED ON SIDE AND PROVIDED WITH A FINISH

by GEORG, PIETSCH, ERNST, FEUCHTINGER, BERND, SAUTER
Year of Publication 15.12.2000

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Method for manufacturing a semiconductor wafer which is coated on one side and provided with a finish

by FEUCHTINGER, ERNST, SAUTER, BERND, PIETSCH, GEORG
Year of Publication 21.07.2000

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Method for manufacturing a semiconductor wafer which is coated on one side and provided with a finish

by PIETSCH; GEORG, SAUTER; BERND, FEUCHTINGER; ERNST
Year of Publication 18.04.2000

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Semiconductor wafer with improved flatness, and process for producing the semiconductor wafer

by FEUCHTINGER, ERNST, WENSKI, GUIDO, ALTMANN, THOMAS, BERNWINKLER, WILLIBALD, WINKLER, WOLFGANG
Year of Publication 21.12.2003

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Method for manufacturing a semiconductor wafer which is coated on one side and provided with a finish

by SAUTER BERND, FEUCHTINGER ERNST, PIETSCH GEORG
Year of Publication 30.03.1999

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METHOD FOR MANUFACTURING SEMICONDUCTOR WAFER WHOSE ONE SURFACE IS COATED AND FINISHED

by ERNST FEUCHTINGER, PIETSCH GEORG, BERND SAUTER
Year of Publication 21.08.1998

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Holder for substrate plates accommodates loosening tools and covers delivery cage to form closed inner chamber, and substrate plates are covered by loosening tools fitted with contact pads

by SEIFERT, DIETER, FEUCHTINGER, ERNST, ALTMANN, THOMAS, EINSIEDLER, JOHANNES
Year of Publication 30.11.2000

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Method and device for removing a semiconductor wafer from a flat substrate

by FEUCHTINGER, ERNST, PIETSCH, GEORG
Year of Publication 21.04.1999

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Method and apparatus to separate a semiconductor wafer from a flat support

by FEUCHTINGER, ERNST, PIETSCH, GEORG
Year of Publication 20.05.1998

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Semiconductor wafer with improved flatness, and process for producing the semiconductor wafer

by FEUCHTINGER ERNST, HEIER GERHARD, BERNWINKLER WILLIBALD, WENSKI GUIDO, ALTMANN THOMAS, WINKLER WOLFGANG
Year of Publication 24.06.2003

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Semiconductor wafer with improved flatness, and process for producing the semiconductor wafer

by Wenski, Guido, Altmann, Thomas, Feuchtinger, Ernst, Bernwinkler, Willibald, Winkler, Wolfgang, Heier, Gerhard
Year of Publication 24.06.2003

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Semiconductor wafer with improved flatness, and process for producing the semiconductor wafer

by FEUCHTINGER ERNST, HEIER GERHARD, BERNWINKLER WILLIBALD, WENSKI GUIDO, ALTMANN THOMAS, WINKLER WOLFGANG
Year of Publication 06.03.2003

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Semiconductor wafer with improved flatness, and process for producing the semiconductor wafer

by Altmann, Thomas, Wenski, Guido, Feuchtinger, Ernst, Bernwinkler, Willibald, Winkler, Wolfgang, Heier, Gerhard
Year of Publication 06.03.2003

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Semiconductor wafer with improved flatness, and process for producing the semiconductor wafer

by FEUCHTINGER ERNST, HEIER GERHARD, BERNWINKLER WILLIBALD, WENSKI GUIDO, ALTMANN THOMAS, WINKLER WOLFGANG
Year of Publication 01.10.2002

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Semiconductor wafer with improved flatness, and process for producing the semiconductor wafer

by Wenski, Guido, Altmann, Thomas, Feuchtinger, Ernst, Bernwinkler, Willibald, Winkler, Wolfgang, Heier, Gerhard
Year of Publication 01.10.2002

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