Search Results - "FAY OWEN R" :: K.UTB vyhledávací portál

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Interconnect structures for preventing solder bridging, and associated systems and methods

by Mayer, Kyle S, Fay, Owen R
Year of Publication 24.03.2020

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Methods and systems for manufacturing pillar structures on semiconductor devices

by Yeruva, Suresh, Jebaraj, Adriel Jebin Jacob, Vadhavkar, Sameer S, Huang, Wayne H, Fay, Owen R
Year of Publication 22.08.2023

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Fabricated Two-Sided Millimeter Wave Antenna Using Through-Silicon-Vias

by Kaeding, John F, Fay, Owen R
Year of Publication 05.03.2020

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HIGH DENSITY PILLAR INTERCONNECT CONVERSION WITH STACK TO SUBSTRATE CONNECTION

by Fay, Owen R, Kirby, Kyle K, Singh, Akshay N
Year of Publication 11.11.2021

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Patent

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Stacked memory package incorporating millimeter wave antenna in die stack

by Kaeding, John F, Fay, Owen R
Year of Publication 18.02.2020

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THREE-DIMENSIONAL STACKING SEMICONDUCTOR ASSEMBLIES WITH NEAR ZERO BOND LINE THICKNESS

by FAY, OWEN R
Year of Publication 11.09.2021

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Tunable integrated millimeter wave antenna using laser ablation and/or fuses

by Kaeding, John F, Fay, Owen R
Year of Publication 30.01.2020

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Three-dimensional stacking semiconductor assemblies with near zero bond line thickness

by FAY, OWEN R
Year of Publication 01.08.2021

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STACKED MEMORY PACKAGE INCORPORATING MILLIMETER WAVE ANTENNA IN DIE STACK

by Kaeding, John F, Fay, Owen R
Year of Publication 02.01.2020

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PACKAGE-ON-PACKAGE SEMICONDUCTOR ASSEMBLIES AND METHODS OF MANUFACTURING THE SAME

by Murray, Jack E, Fay, Owen R
Year of Publication 28.11.2019

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SEMICONDUCTOR ASSEMBLIES WITH REDISTRIBUTION STRUCTURES FOR DIE STACK SIGNAL ROUTING

by Wale, Madison E, Fay, Owen R, Holloway, Dustin L, Voelz, James L, Southern, Dylan W
Year of Publication 11.05.2023

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Patent

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High density pillar interconnect conversion with stack to substrate connection

by Fay, Owen R, Kirby, Kyle K, Singh, Akshay N
Year of Publication 10.08.2021

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HIGH DENSITY PILLAR INTERCONNECT CONVERSION WITH STACK TO SUBSTRATE CONNECTION

by Fay, Owen R, Kirby, Kyle K, Singh, Akshay N
Year of Publication 22.07.2021

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Patent

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Semiconductor Device Assembly with Pillar Array

by Fay, Owen R, Kirby, Kyle K, Singh, Akshay N
Year of Publication 17.06.2021

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Semiconductor devices and methods of making semiconductor devices

by Smith, Steven R, Fay, Owen R
Year of Publication 17.09.2019

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EDGE-NOTCHED SUBSTRATE PACKAGING AND ASSOCIATED SYSTEMS AND METHODS

by Wale, Madison E, Fay, Owen R, Voelz, James L, Southern, Dylan W
Year of Publication 09.02.2023

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Package-on-package semiconductor assemblies and methods of manufacturing the same

by Murray, Jack E, Fay, Owen R
Year of Publication 13.08.2019

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HIGH DENSITY PILLAR INTERCONNECT CONVERSION WITH STACK TO SUBSTRATE CONNECTION

by Fay, Owen R, Kirby, Kyle K, Singh, Akshay N
Year of Publication 06.05.2021

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HIGH DENSITY PILLAR INTERCONNECT CONVERSION WITH STACK TO SUBSTRATE CONNECTION

by Fay, Owen R, Kirby, Kyle K, Singh, Akshay N
Year of Publication 06.05.2021

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Patent

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High density pillar interconnect conversion with stack to substrate connection

by Fay, Owen R, Kirby, Kyle K, Singh, Akshay N
Year of Publication 04.05.2021

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Patent

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