Fabrication of ultra-low density and long-wavelength emission InAs quantum dots
Huang, Shesong, Niu, Zhichuan, Ni, Haiqiao, Xiong, Yonghua, Zhan, Feng, Fang, Zhidan, Xia, Jianbai
Published in Journal of crystal growth (01.04.2007)
Published in Journal of crystal growth (01.04.2007)
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Journal Article
Conference Proceeding
Optical Characteristics of InAs Quantum Dots on GaAs Matrix by Using Various InGaAs Structures
Lingmin, Kong, Jiafa, Cai, Zhengyun, Wu, Zheng, Gong, Zhidan, Fang, Zhichuan, Niu
Published in Journal of Wuhan University of Technology. Materials science edition (01.06.2006)
Published in Journal of Wuhan University of Technology. Materials science edition (01.06.2006)
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Journal Article
Double-sided silicon vias (DSSVs) interconnection for large-sized interposer fabrication
Yang, Haibo, Dai, Fengwei, Cao, Liqiang, Cao, Guofu, Fang, Zhidan, Wang, Qidong
Published in Microelectronics international (17.03.2023)
Published in Microelectronics international (17.03.2023)
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Journal Article
A Fully Integrated Solid-State Charge Detector with through Fused Silica Glass via Process
Wu, Xiaomeng, Wen, Liangjian, Cao, Liqiang, Cao, Guofu, Li, Gaosong, Fu, Yasheng, Yu, Zhongyao, Fang, Zhidan, Wang, Qidong
Published in Electronics (Basel) (01.02.2023)
Published in Electronics (Basel) (01.02.2023)
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Journal Article
New process of copper pillar bumps on substrate
Yang Song, Wenlong Liu, Zhongyao Yu, Xueping Guo, Zhidan Fang, Guowei Ding
Published in 2014 15th International Conference on Electronic Packaging Technology (01.05.2014)
Published in 2014 15th International Conference on Electronic Packaging Technology (01.05.2014)
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Conference Proceeding
Temperature-dependant thermal stress analysis of through-silicon-vias during manufacturing process
Meiying Su, Xia Zhang, Lixi Wan, Daquan Yu, Xiangmeng Jing, Zhidan Fang, Fengze Hou
Published in 2013 14th International Conference on Electronic Packaging Technology (01.08.2013)
Published in 2013 14th International Conference on Electronic Packaging Technology (01.08.2013)
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Conference Proceeding
Multilayer chip embedded based on the organic substrate
Xueping Guo, Zhongyao Yu, Liqiang Cao, Yang Song, Yu Sun, Zhidan Fang, Hu Hao, Guowei Ding
Published in 2014 15th International Conference on Electronic Packaging Technology (01.05.2014)
Published in 2014 15th International Conference on Electronic Packaging Technology (01.05.2014)
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Conference Proceeding
Intelligent Navigation Method for Substation Inspection Robot Based on 3D Point Cloud
Fan, Sheng, Xu, Guowei, Fan, Daoqing, Fang, Zhidan, Liao, Rongzhou
Published in 2024 7th International Conference on Advanced Algorithms and Control Engineering (ICAACE) (01.03.2024)
Published in 2024 7th International Conference on Advanced Algorithms and Control Engineering (ICAACE) (01.03.2024)
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Conference Proceeding
Research on the Reliability of Packaging Interfaces Based on Silicon Bridge Embedment
Zhang, Jie, Shi, Binjie, Ma, Rui, Zhao, Jingyi, Fang, Zhidan, Su, Meiying, Cao, Liqiang
Published in 2024 25th International Conference on Electronic Packaging Technology (ICEPT) (07.08.2024)
Published in 2024 25th International Conference on Electronic Packaging Technology (ICEPT) (07.08.2024)
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Conference Proceeding
Method, device and equipment for optimizing curing process parameters of substrate and medium
DING SHANJUN, FANG ZHIDAN, YU ZHONGYAO, WU XIAOMENG, SUN PENG, YANG FANG
Year of Publication 07.06.2024
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Year of Publication 07.06.2024
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