Plasma immersion ion implantation for SOI synthesis : SIMOX and ion-cut
LU, X, SUNDAR KULAR IYER, S, JIN LEE, DOYLE, B, ZHINENG FAN, CHU, P. K, CHENMING HU, CHEUNG, N. W
Published in Journal of electronic materials (01.09.1998)
Published in Journal of electronic materials (01.09.1998)
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Journal Article
Thickness uniformity of silicon-on-insulator fabricated by plasma immersion ion implantation and ion cut
Fan, Z., Chu, P.K., Cheung, N.W., Chan, C.
Published in IEEE transactions on plasma science (01.04.1999)
Published in IEEE transactions on plasma science (01.04.1999)
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Iyer, S.S.K., Xiang Lu, Jingbao Liu, Jing Min, Zhineng Fan, Chu, P.K., Chenming Hu, Cheung, N.W.
Published in IEEE transactions on plasma science (01.10.1997)
Published in IEEE transactions on plasma science (01.10.1997)
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An adaptable, high performance LGA connector technology
Brown, D.D., Sangjin Hong, Zhineng Fan, Williams, J.D., Che-Yu Li
Published in 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345) (2002)
Published in 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345) (2002)
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Conference Proceeding
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Cai, Biao, Mcilvain, Kevin, Tang, Junyan, Giesen, Kyle, Chen, Zhaoqing, Zhang, Hongqing, Beaman, Brian, Steffen, Chris, Fan, Zhineng, Mahran, Victor, Fukazawa, Luis, Lv, Roc
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
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Conference Proceeding
OpenCAPI Memory Interface Simulation and Test for Differential DIMM Channel with SNIA SFF-TA-1002 Connector
Car, Biao, Hejase, Jose, Mcilvain, Kevin, Giesen, Kyle, Chen, Zhaoqin, Zhang, Hongqing, Tang, Junyan, Nguyen, Megan, Baughen, Devon, Dreps, Daniel, Connolly, Brian, Wiedemeier, Glen, Becker, Dale, Chun, Sungjun, Beaman, Brian, Fan, Zhineng, Huang, Yifan, Wander, Abhijit, Mahran, Victor
Published in 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) (01.06.2020)
Published in 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) (01.06.2020)
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Conference Proceeding
OpenCAPI Memory Interface Signal Integrity Study for High-Speed DDR5 Differential DIMM Channel with Standard Loss FR-4 Material and SNIA SFF-TA-1002 Connector
Cai, Biao, Hejase, Jose, Giesen, Kyle, Tang, Junyan, Connolly, Brian, Kim, KyuHyoun, Dreps, Daniel, Fan, Zhineng, Huang, Rocky, Yi, Luyun, Chen, Qiaoli, Huang, Yifan, Smith, Stephen
Published in 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) (01.05.2019)
Published in 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) (01.05.2019)
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Conference Proceeding