FSW manufacturing process of cold plates compared to brazing for data center liquid cooling
Fan, Yuehong, Yang, Jin, Chuang, Jimmy
Published in 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) (01.06.2021)
Published in 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) (01.06.2021)
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Conference Proceeding
Manifold Integrated Cold Plate for Single-Phase and Two-Phase Liquid Cooling
Fan, Yuehong, Chuang, Jimmy, Shia, David, Prabhugoud, Mohanraj
Published in 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (30.05.2023)
Published in 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (30.05.2023)
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Conference Proceeding
A Novel Prefabricated Grid for Guided Endodontic Microsurgery
Fan, Yuehong, Glickman, Gerald N., Umorin, Mikhail, Nair, Madhu K., Jalali, Poorya
Published in Journal of endodontics (01.05.2019)
Published in Journal of endodontics (01.05.2019)
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Journal Article
Cold Plate Liquid Cooling Solution for Hot-swapped Components in Server System
Fan, Yuehong, Sun, Yanbing, Zhang, Guocheng, Chen, Na, Li, Jinbo, Liu, Guangzhi, Jiang, Shaonan, Zhang, Xiaowei
Published in 2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (28.05.2024)
Published in 2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (28.05.2024)
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Conference Proceeding
Modularized Thermal and Mechanical Cold Plate Based High Power Memory Liquid Cooling Solution
Fan, Yuehong, Que, Xiang, Wang, Chuanlou Felix, Zhang, Ming, Sun, Yanbing, Jiang, Qing, Chen, Na, Li, Jinbo, Liu, Guangzhi, Jiang, Shaonan, Zhang, Xiaowei
Published in 2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (28.05.2024)
Published in 2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (28.05.2024)
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Conference Proceeding
Thermocouple Attachment Methodology for Memory
Tan, Guixiang Ellen, Carte, Casey, Fan, Yuehong
Published in 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) (01.06.2021)
Published in 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) (01.06.2021)
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Conference Proceeding
Coupled Thermal-Electrical Simulation and Validation Test for Novel High Power Delivery Design in CPU Socket Area
Fan, Yuehong, Yan, Hongfei, Zhong, Jack, Shen, Wei
Published in 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (01.05.2019)
Published in 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (01.05.2019)
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Conference Proceeding
A Novel Concept Methodology of In-direct Cold Plate Liquid Cooling Design for Data Center in CPU Socket Area
Sun, Ruiyu, Fu, Qingming, Chen, Guofeng, Li, Yongwei, Wang, Shifeng, Zhang, Jun, Fan, Yuehong, Xia, Yuyang, Ahuja, Nishi
Published in 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (01.07.2020)
Published in 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (01.07.2020)
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Conference Proceeding
An Advanced Cold Plate Liquid Cooling Rack Design for Hyperscale Data Center
Tsai, Yuehlin, Wang, Guilin, Jin, Yuehong, Li, Sheng, Fang, Wenyi, Chen, Guofeng, Cao, Peng, Zhang, Jun, Fan, Yuehong, Xia, Yuyang, Tian, Wenbin, Cheng, Hang, Ruan, Xingping, Zhou, Hongxing, Ahuja, Nishi, Qiao, Qing, Kumar, Mohan
Published in 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) (31.05.2022)
Published in 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) (31.05.2022)
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Conference Proceeding
Investigation on Performance Difference Between Air and Liquid Close Loop Heatsink in a 1U Server
Qi, Feng, Tian, Wenbin, Zhou, Shaorong, Fan, Yuehong, Zhang, Ming, Winkle, Casey
Published in 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (01.05.2019)
Published in 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (01.05.2019)
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Conference Proceeding
Experimental and Numerical Investigation on Liquid Assisted Air Cooling Solution
Tian, Wenbin, Kulkarni, Devdatta, Zhang, Ming, Fan, Yuehong
Published in 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (01.05.2018)
Published in 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (01.05.2018)
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Conference Proceeding
Analytical Design Methodology for Liquid Based Cooling Solution for High TDP CPUs
Fan, Yuehong, Winkel, Casey, Kulkarni, Devdatta, Tian, Wenbin
Published in 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (01.05.2018)
Published in 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (01.05.2018)
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Conference Proceeding
Thermal control for processor-based devices
Winkel, Casey, Pang, Ying-Feng, Subrahmanyam, Prabhakar, Fan, Yuehong, Bu, Yingqiong, Zhang, Ming, Xia, Yi
Year of Publication 27.02.2024
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Year of Publication 27.02.2024
Patent
IMPROVEMENTS TO FLOW ENHANCEMENT STRUCTURE FOR IMMERSION COOLED ELECTRONIC SYSTEMS
YAO, Yang, FAN, Yuehong, YANG, Yue, ZHOU, Shaorong, WANG, Chuanlou, ZHANG, Chen, BU, Yingqiong, ZHANG, Guangying, QUE, Xiang, DU, Liguang
Year of Publication 19.09.2024
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Year of Publication 19.09.2024
Patent
METHODS AND APPARATUS FOR IMMERSION COOLING SYSTEMS
Ahuja, Sandeep, Saini, Satyam, MacDonald, Mark, Damm, Drew, McAfee, Eric D, Fan, Yuehong, Zhang, Ming, Carte, Casey Jamesen, Sarangi, Suchismita, Que, Xiang, Yang, Yue, Gullbrand, Jessica, Yao, Yang
Year of Publication 23.05.2024
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Year of Publication 23.05.2024
Patent
IMMERSION COOLING SYSTEM WITH FIRST AND SECOND PRIMARY LOOPS
HE, Jing-Hua, LI, Xiaowei, FAN, Yuehong, AHUJA, Sandeep, WU, Jay, XUE, Dongrui, CHUANG, Jimmy
Year of Publication 22.02.2024
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Year of Publication 22.02.2024
Patent
IMMERSION COOLING SYSTEMS, APPARATUS, AND RELATED METHODS
BIRCH, Thomas, FAN, Yuehong, ZHOU, Shaorong, WEI, Peng, WONDIMU, Berhanu, TIEN, Ming, SHIA, David, WINKEL, Casey, WU, Dong-Han, SARANGI, Suchismita, MCAFEE, Eric, WANG, Chuanlou, WU, Jay, HE, Jing-Hua John, CHUANG, Jimmy
Year of Publication 04.04.2024
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Year of Publication 04.04.2024
Patent