Semiconductor device and manufacturing method of the same
Fan, Fu-Jier, Tuan, Hsiao-Chin, Thei, Kong-Beng, Song, Jhu-Min, Kalnitsky, Alexander
Year of Publication 25.07.2023
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Year of Publication 25.07.2023
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Through silicon via design for stacking integrated circuits
Fan, Fu-Jier, Liu, Jen-Cheng, Lin, Hsing-Chih, Tuan, Hsiao-Chin, Yaung, Dun-Nian, Thei, Kong-Beng, Chen, Yi-Sheng, Kalnitsky, Alexander
Year of Publication 18.07.2023
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Year of Publication 18.07.2023
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Semiconductor device
Fan, Fu-Jier, Thei, Kong-Beng, Chen, Yi-Sheng, Kao, Jung-Hui, Chen, Yi-Huan, Lin, Kau-Chu
Year of Publication 16.08.2022
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Year of Publication 16.08.2022
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Through silicon via design for stacking integrated circuits
Fan, Fu-Jier, Liu, Jen-Cheng, Lin, Hsing-Chih, Tuan, Hsiao-Chin, Yaung, Dun-Nian, Thei, Kong-Beng, Chen, Yi-Sheng, Kalnitsky, Alexander
Year of Publication 09.05.2023
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Year of Publication 09.05.2023
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High voltage integration for HKMG technology
Fan, Fu-Jier, Tuan, Hsiao-Chin, Thei, Kong-Beng, Chen, Yi-Sheng, Chou, Chien-Chih, Chen, Yi-Huan, Kalnitsky, Alexander
Year of Publication 12.04.2022
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Year of Publication 12.04.2022
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Dishing prevention dummy structures for semiconductor devices
Fan, Fu-Jier, Liu, Szu-Hsien, Lin, Ta-Wei, Thei, Kong-Beng, Chen, Yi-Sheng, Chou, Chien-Chih, Chen, Yi-Huan
Year of Publication 31.01.2023
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Year of Publication 31.01.2023
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THROUGH SILICON VIA DESIGN FOR STACKING INTEGRATED CIRCUITS
Fan, Fu-Jier, Liu, Jen-Cheng, Lin, Hsing-Chih, Tuan, Hsiao-Chin, Yaung, Dun-Nian, Thei, Kong-Beng, Chen, Yi-Sheng, Kalnitsky, Alexander
Year of Publication 22.09.2022
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Year of Publication 22.09.2022
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Semiconductor device
Fan, Fu-Jier, Thei, Kong-Beng, Chen, Yi-Sheng, Kao, Jung-Hui, Chen, Yi-Huan, Lin, Kau-Chu
Year of Publication 02.03.2021
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Year of Publication 02.03.2021
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HIGH VOLTAGE INTEGRATION FOR HKMG TECHNOLOGY
Fan, Fu-Jier, Tuan, Hsiao-Chin, Thei, Kong-Beng, Chen, Yi-Sheng, Chou, Chien-Chih, Chen, Yi-Huan, Kalnitsky, Alexander
Year of Publication 24.12.2020
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Year of Publication 24.12.2020
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THROUGH SILICON VIA DESIGN FOR STACKING INTEGRATED CIRCUITS
Fan, Fu-Jier, Liu, Jen-Cheng, Lin, Hsing-Chih, Tuan, Hsiao-Chin, Yaung, Dun-Nian, Thei, Kong-Beng, Chen, Yi-Sheng, Kalnitsky, Alexander
Year of Publication 04.11.2021
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Year of Publication 04.11.2021
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Recessed STI as the Gate Dielectric of HV Device
Fan, Fu-Jier, Liu, Szu-Hsien, Thei, Kong-Beng, Yeh, Li-Hsuan, Chen, Yi-Sheng, Huo, Ker-Hsiao, Chen, Yi-Huan, Lin, Kau-Chu
Year of Publication 09.09.2021
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Year of Publication 09.09.2021
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High voltage integration for HKMG technology
Fan, Fu-Jier, Tuan, Hsiao-Chin, Thei, Kong-Beng, Chen, Yi-Sheng, Chou, Chien-Chih, Chen, Yi-Huan, Kalnitsky, Alexander
Year of Publication 29.09.2020
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Year of Publication 29.09.2020
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Through silicon via design for stacking integrated circuits
Fan, Fu-Jier, Liu, Jen-Cheng, Lin, Hsing-Chih, Tuan, Hsiao-Chin, Yaung, Dun-Nian, Thei, Kong-Beng, Chen, Yi-Sheng, Kalnitsky, Alexander
Year of Publication 13.07.2021
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Year of Publication 13.07.2021
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DISHING PREVENTION DUMMY STRUCTURES FOR SEMICONDUCTOR DEVICES
Fan, Fu-Jier, Liu, Szu-Hsien, Lin, Ta-Wei, Thei, Kong-Beng, Chen, Yi-Sheng, Chou, Chien-Chih, Chen, Yi-Huan
Year of Publication 24.06.2021
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Year of Publication 24.06.2021
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Recessed STI as the gate dielectric of HV device
Fan, Fu-Jier, Liu, Szu-Hsien, Thei, Kong-Beng, Yeh, Li-Hsuan, Chen, Yi-Sheng, Huo, Ker-Hsiao, Chen, Yi-Huan, Lin, Kau-Chu
Year of Publication 11.05.2021
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Year of Publication 11.05.2021
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Through silicon via design for stacking integrated circuits
Fan, Fu-Jier, Liu, Jen-Cheng, Lin, Hsing-Chih, Tuan, Hsiao-Chin, Yaung, Dun-Nian, Thei, Kong-Beng, Chen, Yi-Sheng, Kalnitsky, Alexander
Year of Publication 30.03.2021
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Year of Publication 30.03.2021
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