Method of making tall flip chip bumps
Peng, Chiou-Shian, Chu, Euegene, Fahn, Alex, Lin, Kenneth, Fane, Gilbert, Chen, James, Lin, Kuo-Wei
Year of Publication 29.06.2004
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Year of Publication 29.06.2004
Patent
Method of making tall flip chip bumps
CHEN JAMES, PENG CHIOU-SHIAN, FAHN ALEX, LIN KUO-WEI, CHU EUEGENE, LIN KENNETH, FANE GILBERT
Year of Publication 29.06.2004
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Year of Publication 29.06.2004
Patent
Method of making tall flip chip bumps
CHEN JAMES, PENG CHIOU-SHIAN, FAHN ALEX, LIN KUO-WEI, CHU EUEGENE, LIN KENNETH, FANE GILBERT
Year of Publication 17.04.2003
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Year of Publication 17.04.2003
Patent
Method of making tall flip chip bumps
Chu, Euegene, Peng, Chiou-Shian, Fahn, Alex, Lin, Kenneth, Fane, Gilbert, Chen, James, Lin, Kuo-Wei
Year of Publication 17.04.2003
Get full text
Year of Publication 17.04.2003
Patent
Method for removing solder bodies from a semiconductor wafer
CHEN JAMES, CHU EUGENE, FAHN ALEX, PENG CHIOU-SHIAN, LIN KUO-WEI, LIN KENNETH, FANE GILBERT
Year of Publication 20.11.2001
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Year of Publication 20.11.2001
Patent