Package including solder resist layer configured as base plane for device
ARAVANI AKSHAY, KIM JONGHAE, LEE CHANG-HO, F.CARRARA, YU XIAOJU, MENGESTY, KEVIN, A, GARCIA DEVIN, KULLMAN MARCUS, LEE JOHN JONG-HOON, NEELAMANKANNAN, SIVAKUMAR
Year of Publication 13.05.2022
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Year of Publication 13.05.2022
Patent