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Scratching by pad asperities in chemical–mechanical polishing
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Eusner, T., Saka, N., Chun, J.-H., Armini, S., Moinpour, M., Fischer, P.
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Published in 2010 International Symposium on Semiconductor Manufacturing (ISSM) (01.10.2010)
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Published in 2010 International Symposium on Semiconductor Manufacturing (ISSM) (01.10.2010)
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Controlling Scratching in Cu Chemical-Mechanical Planarization (CuCMP)
Eusner, Thor, Saka, Nannaji, Chun, Jung-Hoon, Armini, Silvia, Moinpour, Mansour, Fischer, Paul
Published in ECS transactions (20.03.2009)
Published in ECS transactions (20.03.2009)
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