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Year of Publication 27.06.2023
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Method for Fabricating a Semiconductor Flip-Chip Package
Pressel, Klaus, Meyer, Thorsten, Escher-Poeppel, Irmgard, Rakow, Bernd
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Year of Publication 10.12.2020
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Semiconductor Package and Method of Forming a Semiconductor Package
Fuergut, Edward, Gruber, Martin, Otremba, Ralf, Escher-Poeppel, Irmgard
Year of Publication 19.11.2020
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Year of Publication 19.11.2020
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Additive Manufacturing of a Frontside or Backside Interconnect of a Semiconductor Die
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Year of Publication 22.07.2021
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Year of Publication 22.07.2021
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