Low-temperature Au–Si wafer bonding
Jing, Errong, Xiong, Bin, Wang, Yuelin
Published in Journal of micromechanics and microengineering (01.09.2010)
Published in Journal of micromechanics and microengineering (01.09.2010)
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Journal Article
The Bond Strength of Au/Si Eutectic Bonding Studied by IR Microscope
Jing, Errong, Xiong, Bin, Wang, Yuelin
Published in IEEE transactions on electronics packaging manufacturing (01.01.2010)
Published in IEEE transactions on electronics packaging manufacturing (01.01.2010)
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Journal Article
Wafer level vacuum packaged resonator with in-situ Au-Al eutectic Re-Distribution layer
Guoqiang Wu, Dehui Xu, Bin Xiong, Errong Jing, Yuelin Wang
Published in 2012 IEEE Sensors (01.10.2012)
Published in 2012 IEEE Sensors (01.10.2012)
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Conference Proceeding
3D monolithic integrated thermoelectric IR sensor
Dehui Xu, Bin Xiong, Guoqiang Wu, Yinglei Ma, Errong Jing, Yueling Wang
Published in 2012 IEEE Sensors (01.10.2012)
Published in 2012 IEEE Sensors (01.10.2012)
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Conference Proceeding
Wafer-Level Vacuum Packaging of Micromachined Thermoelectric IR Sensors
DEHUI XU, JING, Errong, BIN XIONG, YUELIN WANG
Published in IEEE transactions on advanced packaging (01.11.2010)
Published in IEEE transactions on advanced packaging (01.11.2010)
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Journal Article
Low-temperature Au/a-Si wafer bonding
Jing, Errong, Xiong, Bin, Wang, Yuelin
Published in Journal of micromechanics and microengineering (01.01.2011)
Published in Journal of micromechanics and microengineering (01.01.2011)
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Journal Article
Analysis of air damping in micromachined resonators
Guoqiang Wu, Dehui Xu, Bin Xiong, Yinglei Ma, Yuelin Wang, Errong Jing
Published in 2012 7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems (NEMS) (01.03.2012)
Published in 2012 7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems (NEMS) (01.03.2012)
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Conference Proceeding