Investigation and Modeling of Etching Through Silicon Carbide Vias (TSiCV) for SiC Interposer and Deep SiC Etching for Harsh Environment MEMS by DoE
Mackowiak, Piotr, Erbacher, Kolja, Schiffer, Michael, Manier, Charles-Alix, Topper, Michael, Ngo, Ha-Duong, Schneider-Ramelow, Martin, Lang, Klaus-Dieter
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.03.2022)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.03.2022)
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Journal Article
Piezoresistive 4H-Silicon Carbide (SiC) pressure sensor
Mackowiak, Piotr, Erbacher, Kolja, Baeuscher, Manuel, Schiffer, Michael, Lang, Klaus-Dieter, Schneider-Ramelow, Martin, Ngo, Ha-Duong
Published in 2021 IEEE Sensors (31.10.2021)
Published in 2021 IEEE Sensors (31.10.2021)
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Conference Proceeding
Aero Acoustic MEMS Microphone Integration in Ultra-Thin and Flexible Substrate
Erbacher, Kolja, Marques, Joao Alves, von Krshiwoblozki, Malte, Wu, Lixiang, Ngo, Ha Duong, Schneider-Ramelow, Martin
Published in 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) (07.12.2022)
Published in 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) (07.12.2022)
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Conference Proceeding
A Novel Piezoresitive Microphone MEMS Sensor For Aerospace Applications
Ngo, Ha Duong, Erbacher, Kolja, Wu, Lixiang, Wang, Bei, Pang, Zirui, Weiss, Julien, Acedo, Pablo
Published in 2022 International Conference on Electrical, Computer and Energy Technologies (ICECET) (20.07.2022)
Published in 2022 International Conference on Electrical, Computer and Energy Technologies (ICECET) (20.07.2022)
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Conference Proceeding
Electronics design of piezo-resistive MEMS microphone arrays for aero-acoustics in flight tests
Garcia-Souto, Jose A., Baez-Rivera, Cindy A., Erbacher, Kolja, Carrillo-Agudo, Pablo, Ngo, Ha Duong, Acedo, Pablo
Published in 2023 Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS (DTIP) (28.05.2023)
Published in 2023 Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS (DTIP) (28.05.2023)
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Conference Proceeding
Investigation of Deep Dry Etching of 4H SIC Material for MEMS Applications Using DOE Modelling
Erbacher, Kolja, Mackowiak, Piotr, Schiffer, Michael, Lang, Klaus-Dieter, Schneider-Ramelow, Martin, Ngo, Ha-Duong
Published in 2021 IEEE 34th International Conference on Micro Electro Mechanical Systems (MEMS) (25.01.2021)
Published in 2021 IEEE 34th International Conference on Micro Electro Mechanical Systems (MEMS) (25.01.2021)
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Conference Proceeding
Investigation of Etching SIC VIAS for High Power Elctronics and Harsh Enviornment Mems
Mackowiak, Piotr, Erbacher, Kolja, Schiffer, Michael, Ngo, Ha-Duong, Schneider-Ramelow, Martin, Lang, Klaus-Dieter
Published in 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC) (15.09.2020)
Published in 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC) (15.09.2020)
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Conference Proceeding
Ultra Thin Force and Acceleration Sensor Embedded in Flexible Thin Film Substrates Using Thin Chip Handling, Bonding and Carrier Release Technologies
Mackowiak, Piotr, Erbacher, Kolja, Zoschke, Kai, Al-Magazachi, Samer, Bauscher, Manuel, Schiffer, Michael, Lang, Klaus-Dieter, Ngo, Ha-Duong
Published in 2019 12th International Conference on Developments in eSystems Engineering (DeSE) (01.10.2019)
Published in 2019 12th International Conference on Developments in eSystems Engineering (DeSE) (01.10.2019)
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Conference Proceeding