Low Cost of Ownership scalable copper Direct Bond Interconnect 3D IC technology for three dimensional integrated circuit applications
Enquist, P., Fountain, G., Petteway, C., Hollingsworth, A., Grady, H.
Published in 2009 IEEE International Conference on 3D System Integration (01.09.2009)
Published in 2009 IEEE International Conference on 3D System Integration (01.09.2009)
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Conference Proceeding
Low emitter resistance GaAs based HBT's without InGaAs caps
Slater, D.B., Enquist, P.M., Hutchby, J.A., Morris, A.S., Trew, R.J.
Published in IEEE electron device letters (01.05.1994)
Published in IEEE electron device letters (01.05.1994)
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Journal Article
Self-aligned AlGaAs/GaAs HBT with selectively regrown OMVPE emitter
Enquist, P.M., Slater, D.B., Hutchby, J.A., Morris, A.S., Trew, R.J.
Published in IEEE electron device letters (01.06.1993)
Published in IEEE electron device letters (01.06.1993)
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Journal Article
Monolithic integration of complementary HBTs by selective MOVPE
Slater, D.B., Enquist, P.M., Najjar, F.E., Chen, M.Y., Hutchby, J.A.
Published in IEEE electron device letters (01.04.1990)
Published in IEEE electron device letters (01.04.1990)
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Journal Article
Monolithically integrated SQW laser and HBT laser driver via selective OMVPE regrowth
Slater, D.B., Enquist, P.M., Hutchby, J.A., Reed, F.E., Morris, A.S., Kolbas, R.M., Trew, R.J., Lujan, A.S., Swart, J.W.
Published in IEEE photonics technology letters (01.07.1993)
Published in IEEE photonics technology letters (01.07.1993)
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Journal Article
Millimeter-wave AlGaAs/GaAs p-n-p HBT
Slater, D.B., Enquist, P.M., Chen, M.Y., Hutchby, J.A., Morris, A.S., Trew, R.J.
Published in IEEE electron device letters (01.07.1991)
Published in IEEE electron device letters (01.07.1991)
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Journal Article
Pnp HBT with 66 GHz f(max)
Slater, D B, Enquist, P M, Hutchby, J A, Morris, A S, Trew, R J
Published in IEEE electron device letters (01.03.1994)
Published in IEEE electron device letters (01.03.1994)
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Journal Article
Scalable direct bond technology and applications driving adoption
Enquist, P.
Published in 2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International (01.01.2012)
Published in 2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International (01.01.2012)
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Conference Proceeding
Integrated multiple sensor controlled molecular beam epitaxy for high performance electronic devices
Chow, D.H., Roth, J.A., Thomas, S., Kiziloglu, K., Fields, C.H., Arthur, A., Enquist, P.M., Fountain, G., Reed, F., Johs, B., Olson, G.L., Williamson, W.S.
Published in Conference Proceedings. 2000 International Conference on Indium Phosphide and Related Materials (Cat. No.00CH37107) (2000)
Published in Conference Proceedings. 2000 International Conference on Indium Phosphide and Related Materials (Cat. No.00CH37107) (2000)
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Conference Proceeding
Characteristics and Accuracy of a Fully Corrected Four-port Vector Network Analyzer
Schindler, M., Phillips, P., Fennelly, M., Adamian, V., Enquist, P.
Published in 50th ARFTG Conference Digest (01.12.1997)
Published in 50th ARFTG Conference Digest (01.12.1997)
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Conference Proceeding
3D integration applications for low temperature direct bond technology
Enquist, P.
Published in 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration (01.05.2012)
Published in 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration (01.05.2012)
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Conference Proceeding
Modelling the photoresponse of heterojunction bipolar transistors
deBarros, L E M, Paolella, A, Herczfeld, P, Enquist, P
Published in 1995 25th European Microwave Conference (01.09.1995)
Published in 1995 25th European Microwave Conference (01.09.1995)
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Conference Proceeding
DC performance of GaAs/AlxGa1-xAs P-n-p heterojunction bipolar transistors grown by OMVPE
DE LYON, T, CASEY, H. C. JR, ENQUIST, P. M, HUTCHBY, J. A
Published in IEEE transactions on electron devices (01.08.1988)
Published in IEEE transactions on electron devices (01.08.1988)
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Journal Article