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Edge interconnects for use with circuit boards and integrated circuits

Edge interconnects for use with circuit boards and integrated circuits

by Engelhardt, Jr., Robert Joseph
Year of Publication 23.05.2023

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Patent

Edge Interconnects for Use with Circuit Boards and Integrated Circuits

Edge Interconnects for Use with Circuit Boards and Integrated Circuits

by Engelhardt, JR., Robert Joseph
Year of Publication 29.07.2021

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Patent

Three-Dimensional Printed Circuit Substrate Assembly

Three-Dimensional Printed Circuit Substrate Assembly

by Engelhardt, JR., Robert Joseph, Huener, Jerome David, Kulick, Jason M
Year of Publication 06.10.2022

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Patent