Hardware Design and Thermal Management of Video Accelerator Cards in IOT Applications
Kwong Lee, Eng, Seng Soon, Chin, Choy Wong, Soon, Azuan Mohd Bahar, Amyrul
Published in 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (01.07.2020)
Published in 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (01.07.2020)
Get full text
Conference Proceeding
CPU Package Design Optimization for Performance Improvement and Package Cost reduction
Howe Yin Loo, Boon Howe Oh, Poh Tat Oh, Eng Kwong Lee
Published in 2006 International Conference on Electronic Materials and Packaging (01.12.2006)
Published in 2006 International Conference on Electronic Materials and Packaging (01.12.2006)
Get full text
Conference Proceeding
Package Routing and Thermal Analysis on a Multi-Chip Package (MCP)
Boon Howe Oh, Eng Kwong Lee, Howe Yin Loo, Poh Tat Oh
Published in 2006 International Conference on Electronic Materials and Packaging (01.12.2006)
Published in 2006 International Conference on Electronic Materials and Packaging (01.12.2006)
Get full text
Conference Proceeding
Challenges in Stacked CSP Packaging Technology
Boon Howe Oh, Howe Yin Loo, Poh Tat Oh, Eng Kwong Lee
Published in 2006 International Conference on Electronic Materials and Packaging (01.12.2006)
Published in 2006 International Conference on Electronic Materials and Packaging (01.12.2006)
Get full text
Conference Proceeding
The Evolution of CPU Packaging Technology and Future Challenges
Boon Howe Oh, Eng Kwong Lee, Howe Yin Loo, Poh Tat Oh
Published in 2006 International Conference on Electronic Materials and Packaging (01.12.2006)
Published in 2006 International Conference on Electronic Materials and Packaging (01.12.2006)
Get full text
Conference Proceeding
Thermal simulation and power map modeling sensitivity study for chipset silicon
Eng Kwong Lee, Sasidaran, D., Wai Keong Cheang, Song Chin Deo, Kiat Hong Ng, Chee Siong Lee
Published in 2007 International Conference on Electronic Materials and Packaging (01.11.2007)
Published in 2007 International Conference on Electronic Materials and Packaging (01.11.2007)
Get full text
Conference Proceeding
CONTROLLING A MOBILE ROBOT
Oboril, Fabian, Buerkle, Cornelius, Pasch, Frederik, Lee, Eng Kwong, Yew, Chien Chern, Gassmann, Bernd, Liew, Ying Wei, Tan, Say Chuan
Year of Publication 14.04.2022
Get full text
Year of Publication 14.04.2022
Patent