A biomechanical comparison of countermovement performance after short-term traditional and daily-undulated loaded vertical jump training
Pelzer, Thiemo, Ullrich, Boris, Endler, Stefan, Rasche, Christian, Pfeiffer, Mark
Published in Journal of sports sciences (01.08.2018)
Published in Journal of sports sciences (01.08.2018)
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Journal Article
Compensation of externally applied mechanical stress by stacking of ultrathin chips
Endler, Stefan, Rempp, Horst, Harendt, Christine, Burghartz, Joachim N.
Published in Solid-state electronics (01.08.2012)
Published in Solid-state electronics (01.08.2012)
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Journal Article
Two-Dimensional Flex Sensor Exploiting Stacked Ultrathin Chips
Endler, S., Ferwana, S., Rempp, H., Harendt, C., Burghartz, J. N.
Published in IEEE electron device letters (01.03.2012)
Published in IEEE electron device letters (01.03.2012)
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Journal Article
Compensation of externally applied mechanical stress by stacking of ultra-thin chips
Endler, S., Rempp, H., Harendt, C., Burghartz, J. N.
Published in 2011 Proceedings of the European Solid-State Device Research Conference (ESSDERC) (01.09.2011)
Published in 2011 Proceedings of the European Solid-State Device Research Conference (ESSDERC) (01.09.2011)
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Conference Proceeding
Manufacturing aspects of an ultra-thin chip technology
Angelopoulos, E. A., Al-Shahed, M. S., Appel, W., Endler, S., Ferwana, S., Harendt, C., Hassan, M., Rempp, H., Zimmermann, M., Burghartz, J. N.
Published in 2012 Proceedings of the European Solid-State Device Research Conference (ESSDERC) (01.09.2012)
Published in 2012 Proceedings of the European Solid-State Device Research Conference (ESSDERC) (01.09.2012)
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Conference Proceeding
Component and Method for Manufacturing a Component
Puff, Markus, Redolfi, Sebastian, Bernert, Thomas, Krenn, Michael, Endler, Stefan, Bigl, Stephan, Ihle, Jan
Year of Publication 08.09.2022
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Year of Publication 08.09.2022
Patent
Component and method for producing component
IHLE JAN, KRENN MICHAEL, REDOLFI SEBASTIAN, BIGL STEFAN, ENDLER STEFAN BERND, BERNERT THOMAS, PUFF MARKUS
Year of Publication 08.04.2022
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Year of Publication 08.04.2022
Patent
COMPONENT AND METHOD FOR PRODUCING A COMPONENT
IHLE, Jan, PUFF, Markus, KRENN, Michael, BERNERT, Thomas, BIGL, Stephan, ENDLER, Stefan Bernd, REDOLFI, Sebastian
Year of Publication 10.06.2021
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Year of Publication 10.06.2021
Patent
COMPONENT AND METHOD FOR PRODUCING A COMPONENT
IHLE, Jan, PUFF, Markus, KRENN, Michael, BERNERT, Thomas, BIGL, Stephan, ENDLER, Stefan Bernd, REDOLFI, Sebastian
Year of Publication 22.04.2021
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Year of Publication 22.04.2021
Patent
Bauelement und Verfahren zur Herstellung eines Bauelements
Puff, Markus, Endler, Stefan Bernd, Redolfi, Sebastian, Bernert, Thomas, Krenn, Michael, Bigl, Stephan, Ihle, Jan
Year of Publication 21.01.2021
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Year of Publication 21.01.2021
Patent
Ultra-thin chip technology for system-in-foil applications
Angelopoulos, E A, Zimmermann, M, Appel, W, Endler, S, Ferwana, S, Harendt, C, Tu Hoang, Pruemm, A, Burghartz, J N
Published in 2010 International Electron Devices Meeting (01.12.2010)
Published in 2010 International Electron Devices Meeting (01.12.2010)
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Conference Proceeding