Lead-free TQFP package achieved JEDEC level 1/260/spl deg/C by specific combination of die attach adhesive and leadframe
Takano, T., Renyi Wang, Kuder, R., Lam, S., Kuriyama, K., Seki, K., Yoshie, T., Sakai, A., Emmerson, G.T., Seeley, G.J.
Published in 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546) (2004)
Published in 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546) (2004)
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