Interfacial thermal resistance and temperature dependence of three adhesives for electronic packaging
Hasselman, D.P.H., Donaldson, K.Y., Barlow, F.D., Elshabini, A.A., Schiroky, G.H., Yaskoff, J.P., Dietz, R.L.
Published in IEEE transactions on components and packaging technologies (01.12.2000)
Published in IEEE transactions on components and packaging technologies (01.12.2000)
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