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Effect of Rare Earth Elements Addition and Sintering Conditions on the Microstructure and Microhardness of Inconel 718
Medrano-Prieto, H. M., Santos-Beltrán, A., Gallegos-Orozco, V., Santos-Beltrán, M. M., Camacho-Montes, H., Garay-Reyes, C. G., Ruiz-Esparza-Rodriguez, M. A., Estrada-Guel, I., Rodríguez-Cabriales, G., Guía-Tello, J. C., Mendoza-Duarte, J. M., Silva-Aceves, J. M., Castro-Carmona, J. S., Martínez-Sánchez, R.
Published in Metallography, microstructure, and analysis (01.02.2024)
Published in Metallography, microstructure, and analysis (01.02.2024)
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Interfacial microstructure in the reaction between BiIn solder and Cu substrate
Wang, Yi-Wun, Lin, Tzu-Yi, Tsai, Cheng-Ting
Published in Journal of materials science. Materials in electronics (01.01.2025)
Published in Journal of materials science. Materials in electronics (01.01.2025)
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Greenhouse Gas Accumulation in the Soil Profile is not Always Related to Surface Emissions in a Prairie Pothole Agricultural Landscape
Gao, Xiaopeng, Rajendran, Nandakumar, Tenuta, Mario, Dunmola, Adedeji, Burton, David L.
Published in Soil Science Society of America journal (01.05.2014)
Published in Soil Science Society of America journal (01.05.2014)
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Characterization and Functional Properties of Electroplated Silver and Silver Alloys from Cyanide Free Electrolytes
Orecchioni, Quentin, Gigandet, Marie-Pierre, Bedjou, Walid, Tardelli, Joffrey, Hihn, Jean-Yves
Published in Meeting abstracts (Electrochemical Society) (22.11.2024)
Published in Meeting abstracts (Electrochemical Society) (22.11.2024)
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Rod and cone contributions to the a-wave of the electroretinogram of the macaque
Robson, John G., Saszik, Shannon M., Ahmed, Jameel, Frishman, Laura J.
Published in The Journal of physiology (01.03.2003)
Published in The Journal of physiology (01.03.2003)
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The Effect of SnxAgCu and SnAgCuX on the Mechanical Drop Performance in Lead Free CSP Package
Lee, J.C.B., Chen, P.C., Yi-Shao Lai
Published in 2007 8th International Conference on Electronic Packaging Technology (01.08.2007)
Published in 2007 8th International Conference on Electronic Packaging Technology (01.08.2007)
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MISCONCEPTION ANALYSIS OF MATH CLASS VII USING THREE TIER-TEST
Riswandi, Akmal, Nursalam, Nursalam, Baharuddin, Baharuddin
Published in MaPan : Jurnal Matematika dan Pembelajaran (Online) (25.06.2022)
Published in MaPan : Jurnal Matematika dan Pembelajaran (Online) (25.06.2022)
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