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Reassessment of degradation mechanisms in anodic tantalum oxide capacitors under high electric fields
Su, Xin, Viste, Mark, Hossick-Schott, Joachim, Yang, Lei, Sheldon, Brian W.
Published in Journal of materials science (01.01.2015)
Published in Journal of materials science (01.01.2015)
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Journal Article
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Assembly & method for handling electronic components
SCHMID, DIETER, SCHOTTL, THOMAS, WIESBOCK, ANDREAS, HITMANN, RAINER, KUNZLI, SERGE, SCHAULE, MAX, CHARPIE, MICHEL
Year of Publication 11.03.2019
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Year of Publication 11.03.2019
Patent
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New Methodologies for Evaluating Microelectronics Subject to Board-level Vibrations
Khaldarov, Valeriy, Xie, Dongji, Lee, Jeffrey, Shalumov, Alexander
Published in Proceedings / Electronic Components Conference (01.06.2021)
Published in Proceedings / Electronic Components Conference (01.06.2021)
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Conference Proceeding
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Mounting apparatus for electronic components
IEIZUMI, KAZUYOSHI, IZUHARA, KOITI, OONISHI, SEIJI, KASHITANI, HISAYOSHI
Year of Publication 05.01.2011
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Year of Publication 05.01.2011
Patent
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Process for placing, securing and interconnecting electronic components
OTTE RICHARD, BINKLEY EDWARD, CATTANEO ROBERT, NGHI HIEP, LAURIE GEORGE
Year of Publication 24.02.2015
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Year of Publication 24.02.2015
Patent
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Mitigation of warping of electronic components
Plucinski, Mark D, Tofil, Timothy J, Kuczynski, Joseph, O'Connell, Kevin M, Czaplewski, Sarah K, Peterson, Chelsie M
Year of Publication 07.08.2018
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Year of Publication 07.08.2018
Patent