Loading…
Recent advances in lipid analysis by capillary electromigration methods, 2019–2024
Gavard, Pierre, Gavard, Amélie, Perquis, Lucie, Collin, Fabrice, Couderc, François
Published in Journal of Chromatography A (12.04.2025)
Published in Journal of Chromatography A (12.04.2025)
Get full text
Journal Article
Loading…
Loading…
Fast Electromigration Stress Evolution Analysis for Interconnect Trees Using Krylov Subspace Method
Cook, Chase, Sun, Zeyu, Demircan, Ertugrul, Shroff, Mehul D., Tan, Sheldon X.-D.
Published in IEEE transactions on very large scale integration (VLSI) systems (01.05.2018)
Published in IEEE transactions on very large scale integration (VLSI) systems (01.05.2018)
Get full text
Journal Article
Loading…
Loading…
Loading…
Global existence for diffusion–electromigration systems in space dimension three and higher
Bothe, Dieter, Fischer, André, Pierre, Michel, Rolland, Guillaume
Published in Nonlinear analysis (01.04.2014)
Published in Nonlinear analysis (01.04.2014)
Get full text
Journal Article
Loading…
Strengthening the Electromigration Resistance of Nanoscaled Copper Lines by (3-aminopropyl)trimethoxysilane Self-Assembled Monolayer
Fang, Jau-Shiung, Lee, Ching-En, Cheng, Yi-Lung, Chen, Giin-Shan
Published in ECS journal of solid state science and technology (01.08.2021)
Published in ECS journal of solid state science and technology (01.08.2021)
Get full text
Journal Article
Loading…
Electromigration-Induced Bit-Error-Rate Degradation of Interconnect Signal Paths Characterized from a 16nm Test Chip
Pande, N., Zhou, C., Lin, MH, Fung, R., Wong, R., Wen, S., Kim, C. H.
Published in Digest of technical papers - Symposium on VLSI Technology (13.06.2021)
Get full text
Published in Digest of technical papers - Symposium on VLSI Technology (13.06.2021)
Conference Proceeding
Loading…
Invited: Cross-layer modeling and optimization for electromigration induced reliability
Taeyoung Kim, Zeyu Sun, Cook, Chase, Hengyang Zhao, Ruiwen Li, Wong, Daniel, Tan, Sheldon X.-D
Published in 2016 53nd ACM/EDAC/IEEE Design Automation Conference (DAC) (05.06.2016)
Published in 2016 53nd ACM/EDAC/IEEE Design Automation Conference (DAC) (05.06.2016)
Get full text
Conference Proceeding
Loading…
Loading…
An Interconnect Reliability-Driven Routing Technique for Electromigration Failure Avoidance
Chen, Xiaodao, Liao, Chen, Wei, Tongquan, Hu, Shiyan
Published in IEEE transactions on dependable and secure computing (01.09.2012)
Published in IEEE transactions on dependable and secure computing (01.09.2012)
Get full text
Journal Article
Loading…
Investigation of electromigration reliability of redistribution lines in wafer-level chip-scale packages
Kao, Chin-Li, Chen, Tei-Chen, Lai, Yi-Shao, Chiu, Ying-Ta
Published in Microelectronics and reliability (01.11.2014)
Published in Microelectronics and reliability (01.11.2014)
Get full text
Journal Article
Loading…
Loading…
Finite Element Approximation of a Phase Field Model for Void Electromigration
Barrett, John W., Nürnberg, Robert, Styles, Vanessa
Published in SIAM journal on numerical analysis (01.01.2004)
Published in SIAM journal on numerical analysis (01.01.2004)
Get full text
Journal Article
Loading…
Increase of Gilbert damping in Permalloy thin films due to heat-induced structural changes
Schulz, Frank, Lawitzki, Robert, Głowiński, Hubert, Lisiecki, Filip, Träger, Nick, Kuświk, Piotr, Goering, Eberhard, Schütz, Gisela, Gräfe, Joachim
Published in Journal of applied physics (21.04.2021)
Published in Journal of applied physics (21.04.2021)
Get full text
Journal Article
Loading…