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THERMAL MANAGEMENT IN INTEGRATED CIRCUIT PACKAGES

THERMAL MANAGEMENT IN INTEGRATED CIRCUIT PACKAGES

by Aleksov, Aleksandar, Eid, Feras, Dogiamis, Georgios, Swan, Johanna M, Kamgaing, Telesphor
Year of Publication 25.01.2024

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Patent

MICROELECTRONIC DEVICES DESIGNED WITH MODULAR SUBSTRATES HAVING INTEGRATED FUSES

MICROELECTRONIC DEVICES DESIGNED WITH MODULAR SUBSTRATES HAVING INTEGRATED FUSES

by FERAS EID
Year of Publication 15.01.2019

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Patent

Microelectronic assemblies having substrate-integrated perovskite layers

Microelectronic assemblies having substrate-integrated perovskite layers

by Sounart, Thomas, Eid, Feras, Liff, Shawna M, Swan, Johanna M
Year of Publication 12.04.2022

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Patent

MICROELECTRONIC ASSEMBLIES

MICROELECTRONIC ASSEMBLIES

by SWAN, Johanna M, LIFF, Shawna, EID, Feras, ELSHERBINI, Adel A
Year of Publication 16.03.2022

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Patent

Thermal management in integrated circuit packages

Thermal management in integrated circuit packages

by Aleksov, Aleksandar, Eid, Feras, Dogiamis, Georgios, Swan, Johanna M, Kamgaing, Telesphor
Year of Publication 28.11.2023

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Patent

DIRECT BONDING IN MICROELECTRONIC ASSEMBLIES

DIRECT BONDING IN MICROELECTRONIC ASSEMBLIES

by Aleksov, Aleksandar, Le, Van H, Eid, Feras, Liff, Shawna M, Elsherbini, Adel A, Osborne, Randy B, Swan, Johanna M
Year of Publication 10.10.2024

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Patent

Fluidic Self Alignment for Hybrid Bonding Using Intel Process

Fluidic Self Alignment for Hybrid Bonding Using Intel Process

by Eid, Feras, Shi, Y., Naderi, G., Sinha, S-B, Jordan, R., Li, W., El Helou, C., Bedoya, F., Roy, A., Mahdi, T., Chen, J-R, Rawlings, B., Barley, B., Benson, S., Baker, M., Myers, P., Allen, M., Lopez, A., Saucedo, J., Minn, K., Dong, S., Bielefeld, J., Vreeland, R., Brezinski, W, Olmos, F., Woods, C., Swan, J.
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)

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Conference Proceeding

MICROELECTRONIC DEVICES DESIGNED WITH MOLD PATTERNING TO CREATE PACKAGE-LEVEL COMPONENTS FOR HIGH FREQUENCY COMMUNICATION SYSTEMS

MICROELECTRONIC DEVICES DESIGNED WITH MOLD PATTERNING TO CREATE PACKAGE-LEVEL COMPONENTS FOR HIGH FREQUENCY COMMUNICATION SYSTEMS

by KAMGAING, Telesphor, EID, Feras, ALEKSOV, Aleksandar, OSTER, Sasha N, DOGIAMIS, Georgios C
Year of Publication 26.10.2023

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Patent

Thermal management in integrated circuit packages

Thermal management in integrated circuit packages

by Aleksov, Aleksandar, Eid, Feras, Dogiamis, Georgios, Swan, Johanna M, Kamgaing, Telesphor
Year of Publication 10.10.2023

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Patent

Die backend diodes for electrostatic discharge (ESD) protection

Die backend diodes for electrostatic discharge (ESD) protection

by Aleksov, Aleksandar, Eid, Feras, Elsherbini, Adel A, Strong, Veronica Aleman, Swan, Johanna M
Year of Publication 10.10.2023

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Patent

ARCHITECTURES AND METHODS OF FABRICATING 3D STACKED PACKAGES

ARCHITECTURES AND METHODS OF FABRICATING 3D STACKED PACKAGES

by Sounart, Thomas, Eid, Feras, Nair, Vijay K
Year of Publication 23.04.2020

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Patent

PACKAGE STRUCTURES WITH NON-UNIFORM INTERCONNECT FEATURES

PACKAGE STRUCTURES WITH NON-UNIFORM INTERCONNECT FEATURES

by Baker, Michael, Swan, Johanna, Eid, Feras, Li, Wenhao, Liu, Pilin, Li, Zhaozhi
Year of Publication 05.10.2023

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Patent

Package with a highly conductive layer deposited on die using throughput additive deposition prior to TIM1 dispense

Package with a highly conductive layer deposited on die using throughput additive deposition prior to TIM1 dispense

by Eid, Feras, Beatty, John J, Chan Arguedas, Sergio, Swan, Johanna M
Year of Publication 03.10.2023

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Patent

MICROELECTRONIC ASSEMBLIES

MICROELECTRONIC ASSEMBLIES

by LIFF, Shawna M, SWAN, Johanna M, EID, Feras, ELSHERBINI, Adel A
Year of Publication 27.09.2023

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Patent

MODULAR MICROCHANNEL THERMAL SOLUTIONS FOR INTEGRATED CIRCUIT DEVICES

MODULAR MICROCHANNEL THERMAL SOLUTIONS FOR INTEGRATED CIRCUIT DEVICES

by Eid, Feras, Dogiamis, Georgios, Elsherbini, Adel, Morein, Stephen
Year of Publication 30.12.2021

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Patent

Direct bonding in microelectronic assemblies

Direct bonding in microelectronic assemblies

by Aleksov, Aleksandar, Le, Van H, Eid, Feras, Liff, Shawna M, Elsherbini, Adel A, Osborne, Randy B, Swan, Johanna M
Year of Publication 06.08.2024

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Patent

INTEGRATED CIRCUIT HEAT SPREADER INCLUDING SEALANT INTERFACE MATERIAL

INTEGRATED CIRCUIT HEAT SPREADER INCLUDING SEALANT INTERFACE MATERIAL

by Falola, Bamidele Daniel, Eid, Feras, Chan Arguedas, Sergio Antonio
Year of Publication 23.12.2021

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Patent

ADDITIVE MANUFACTURING FOR INTEGRATED CIRCUIT ASSEMBLY CONNECTOR SUPPORT STRUCTURES

ADDITIVE MANUFACTURING FOR INTEGRATED CIRCUIT ASSEMBLY CONNECTOR SUPPORT STRUCTURES

by Swan, Johanna, Eid, Feras, Dogiamis, Georgios, Elsherbini, Adel
Year of Publication 23.12.2021

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Patent

THERMAL MANAGEMENT SOLUTIONS FOR SUBSTRATES IN INTEGRATED CIRCUIT PACKAGES

THERMAL MANAGEMENT SOLUTIONS FOR SUBSTRATES IN INTEGRATED CIRCUIT PACKAGES

by Swan, Johanna, Eid, Feras, Elsherbini, Adel
Year of Publication 26.03.2020

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Patent

THERMAL MANAGEMENT SOLUTIONS FOR EMBEDDED INTEGRATED CIRCUIT DEVICES

THERMAL MANAGEMENT SOLUTIONS FOR EMBEDDED INTEGRATED CIRCUIT DEVICES

by Swan, Johanna, Eid, Feras, Elsherbini, Adel
Year of Publication 26.03.2020

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Patent

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