Search Results - "Eid Feras" :: K.UTB vyhledávací portál | TBU Library Retrieval Portal

Heat dissipation device having anisotropic thermally conductive sections and isotropic thermally conductive sections

Heat dissipation device having anisotropic thermally conductive sections and isotropic thermally conductive sections

by Swan, Johanna, Eid, Feras, Elsherbini, Adel
Year of Publication 19.03.2024

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Patent

Additive manufacturing for integrated circuit assembly cables

Additive manufacturing for integrated circuit assembly cables

by Dogiamis, Georgios, Eid, Feras, Elsherbini, Adel
Year of Publication 06.02.2024

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Patent

Additive manufacturing for integrated circuit assembly connectors

Additive manufacturing for integrated circuit assembly connectors

by Dogiamis, Georgios, Eid, Feras, Elsherbini, Adel
Year of Publication 30.01.2024

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Patent

Thermal management solutions that reduce inductive coupling between stacked integrated circuit devices

Thermal management solutions that reduce inductive coupling between stacked integrated circuit devices

by Swan, Johanna, Eid, Feras, Elsherbini, Adel
Year of Publication 21.11.2023

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Patent

DIE BACKSIDE FILM WITH OVERHANG FOR DIE SIDEWALL PROTECTION

DIE BACKSIDE FILM WITH OVERHANG FOR DIE SIDEWALL PROTECTION

by Eid, Feras, Brun, Xavier, Deb, Nabankur
Year of Publication 05.10.2023

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Patent

PACKAGE WITH IMPROVED THERMALS

PACKAGE WITH IMPROVED THERMALS

by Swan, Johanna, Eid, Feras
Year of Publication 25.06.2020

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Patent

METAL MATRIX COMPOSITE LAYERS HAVING GRADED FILLER CONTENT FOR HEAT DISSIPATION FROM INTEGRATED CIRCUIT DEVICES

METAL MATRIX COMPOSITE LAYERS HAVING GRADED FILLER CONTENT FOR HEAT DISSIPATION FROM INTEGRATED CIRCUIT DEVICES

by Eid, Feras, Tomita, Yoshihiro, Li, Wenhao
Year of Publication 07.09.2023

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Patent

METAL MATRIX COMPOSITE LAYERS FOR HEAT DISSIPATION FROM INTEGRATED CIRCUIT DEVICES

METAL MATRIX COMPOSITE LAYERS FOR HEAT DISSIPATION FROM INTEGRATED CIRCUIT DEVICES

by Eid, Feras, Tomita, Yoshihiro, Li, Wenhao
Year of Publication 07.09.2023

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Patent

Thermal management solutions for stacked integrated circuit devices

Thermal management solutions for stacked integrated circuit devices

by Swan, Johanna, Eid, Feras, Elsherbini, Adel
Year of Publication 27.06.2023

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Patent

INDUCTIVE INERTIAL SENSOR ARCHITECTURE & FABRICATION IN PACKAGING BUILD-UP LAYERS

INDUCTIVE INERTIAL SENSOR ARCHITECTURE & FABRICATION IN PACKAGING BUILD-UP LAYERS

by MA QING, LIN KEVIN L, SWAN JOHANNA M, TEH WENG HONG, RAO VALLURI R, EID FERAS
Year of Publication 04.08.2014

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Patent

THERMAL MANAGEMENT SOLUTIONS FOR EMBEDDED INTEGRATED CIRCUIT DEVICES

THERMAL MANAGEMENT SOLUTIONS FOR EMBEDDED INTEGRATED CIRCUIT DEVICES

by Swan, Johanna, Eid, Feras, Elsherbini, Adel
Year of Publication 04.05.2023

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Patent

Thermal management solutions that reduce inductive coupling between stacked integrated circuit devices

Thermal management solutions that reduce inductive coupling between stacked integrated circuit devices

by Swan, Johanna, Eid, Feras, Elsherbini, Adel
Year of Publication 04.04.2023

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Patent

Thermal management solutions for embedded integrated circuit devices

Thermal management solutions for embedded integrated circuit devices

by Swan, Johanna, Eid, Feras, Elsherbini, Adel
Year of Publication 28.03.2023

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Patent

Thermal management solutions for stacked integrated circuit devices

Thermal management solutions for stacked integrated circuit devices

by Swan, Johanna, Eid, Feras, Elsherbini, Adel
Year of Publication 25.10.2022

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Patent

Integration And Process Challenges Of Self Assembly Applied To Die-To-Wafer Hybrid Bonding

Integration And Process Challenges Of Self Assembly Applied To Die-To-Wafer Hybrid Bonding

by Bourjot, Emilie, Bond, Alice, Nadi, Noura, Enot, Thierry, Sanchez, Loic, Montmeat, Pierre, Martin, Benoit, Campo, Alain, Fournel, Frank, Eid, Feras, Swan, Johanna
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)

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Conference Proceeding

Thermal management solutions for substrates in integrated circuit packages

Thermal management solutions for substrates in integrated circuit packages

by Swan, Johanna, Eid, Feras, Elsherbini, Adel
Year of Publication 16.08.2022

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Patent

PACKAGE WITH IMPROVED THERMALS

PACKAGE WITH IMPROVED THERMALS

by EID, Feras, SWAN, Johanna
Year of Publication 04.04.2019

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Patent

SPLIT METALLIZATION LAYERS IN MULTICHIP DEVICES

SPLIT METALLIZATION LAYERS IN MULTICHIP DEVICES

by Karhade, Omkar, Liff, Shawna, Eid, Feras, Choi, Beomseok, Elsherbini, Adel
Year of Publication 22.02.2024

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Patent

Thermal management solutions for embedded integrated circuit devices

Thermal management solutions for embedded integrated circuit devices

by Swan, Johanna, Eid, Feras, Elsherbini, Adel
Year of Publication 24.05.2022

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Patent

Package wrap-around heat spreader

Package wrap-around heat spreader

by Eid, Feras, Chang, Je-Young, Jha, Chandra Mohan
Year of Publication 26.12.2023

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Patent

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