Ultrafast-laser dicing of thin silicon wafers: strategies to improve front- and backside breaking strength
Domke, Matthias, Egle, Bernadette, Stroj, Sandra, Bodea, Marius, Schwarz, Elisabeth, Fasching, Gernot
Published in Applied physics. A, Materials science & processing (01.12.2017)
Published in Applied physics. A, Materials science & processing (01.12.2017)
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Journal Article
Ultrashort pulse laser dicing of thin Si wafers: the influence of laser-induced periodic surface structures on the backside breaking strength
Domke, Matthias, Egle, Bernadette, Piredda, Giovanni, Stroj, Sandra, Fasching, Gernot, Bodea, Marius, Schwarz, Elisabeth
Published in Journal of micromechanics and microengineering (01.11.2016)
Published in Journal of micromechanics and microengineering (01.11.2016)
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Journal Article