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"ERB; DARRELL"
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"ERB; DARRELL"
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Low temperature dielectric deposition to improve copper electromigration performance
by
Avanzino, Steven
,
Erb
,
Darrell
Year of Publication
05.02.2004
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Sacrificial inlay process for improved integration of porous interlevel dielectrics
by
Erb
,
Darrell
,
Adem, Ercan
Year of Publication
27.11.2003
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Predicting EM reliability by decoupling extrinsic and intrinsic sigma
by
MARATHE AMIT P
,
ERB DARRELL
Year of Publication
05.12.2006
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Predicting EM reliability by decoupling extrinsic and intrinsic sigma
by
Marathe, Amit P
,
Erb
,
Darrell
Year of Publication
05.12.2006
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High planarity high-density in-laid metallization patterns by damascene-CMP processing
by
ERB
;
DARRELL
M
Year of Publication
22.08.2000
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Diffusion barrier and method for its production
by
Erb
,
Darrell
M
,
Wang, Fei
Year of Publication
29.06.2004
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Diffusion barrier and method for its production
by
ERB DARRELL
M
,
WANG FEI
Year of Publication
29.06.2004
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Sacrificial inlay process for improved integration of porous interlevel dielectrics
by
ADEM ERCAN
,
ERB DARRELL
M
Year of Publication
27.11.2003
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Damascene processing using dielectric barrier films
by
ERB DARRELL
M
,
WANG FEI
,
YANG KAI
Year of Publication
15.02.2007
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SACRIFICIAL INLAY PROCESS FOR IMPROVED INTEGRATION OF POROUS INTERLEVEL DIELECTRICS
by
ADEM, ERCAM
,
ERB
,
DARRELL
, M
Year of Publication
26.06.2003
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Stabilizing fluorine etching of low-k materials
by
Yang, Kai
,
Erb
,
Darrell
M
,
Wang, Fei
Year of Publication
07.11.2006
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Stabilizing fluorine etching of low-k materials
by
ERB DARRELL
M
,
WANG FEI
,
YANG KAI
Year of Publication
07.11.2006
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Damascene processing using dielectric barrier films
by
ERB DARRELL
M
,
WANG FEI
,
YANG KAI
Year of Publication
02.02.2005
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Low temperature dielectric deposition to improve copper electromigration performance
by
Avanzino, Steven C
,
Erb
,
Darrell
M
Year of Publication
29.06.2004
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Low temperature dielectric deposition to improve copper electromigration performance
by
ERB DARRELL
M
,
AVANZINO STEVEN C
Year of Publication
29.06.2004
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Use of an alloying element to form a stable oxide layer on the surface of metal features
by
ERB DARRELL
M
,
MARATHE AMIT P
Year of Publication
06.04.2004
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Use of an alloying element to form a stable oxide layer on the surface of metal features
by
Marathe, Amit P
,
Erb
,
Darrell
M
Year of Publication
06.04.2004
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Low temperature dielectric deposition to improve copper electromigration performance
by
ERB DARRELL
M
,
AVANZINO STEVEN C
Year of Publication
05.02.2004
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DAMASCENE PROCESSING USING DIELECTRIC BARRIER FILMS
by
WANG, FEI
,
ERB
,
DARRELL
, M
,
YANG, KAI
Year of Publication
02.01.2004
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Composite tantalum nitride/tantalum copper capping layer
by
Erb
,
Darrell
M
,
Avanzino, Steven C
,
Woo, Christy Mei-Chu
Year of Publication
02.01.2007
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