Evaluation of thermal fatigue crack propagation in underfill resin materials for electronic packages
Watanabe, Yusuke, Yamaguchi, Hiroshi, Enomoto, Toshiaki, Ogawa, Kensuke, Kobayashi, Takaya, Omiya, Masaki
Published in Fatigue & fracture of engineering materials & structures (01.05.2022)
Published in Fatigue & fracture of engineering materials & structures (01.05.2022)
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Journal Article
Design of underfill materials for the latest package
Suzuki, Osamu, Enomoto, Toshiaki, Kotaka, Kiyoshi
Published in 2018 International Symposium on Semiconductor Manufacturing (ISSM) (01.12.2018)
Published in 2018 International Symposium on Semiconductor Manufacturing (ISSM) (01.12.2018)
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Conference Proceeding
Mixed Mode Tension Test of Underfills
YAMAGUCHI, Hiroshi, ENOMOTO, Toshiaki
Published in 2019 International Conference on Electronics Packaging (ICEP) (01.04.2019)
Published in 2019 International Conference on Electronics Packaging (ICEP) (01.04.2019)
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Conference Proceeding
VISCOSITY BEHAVIOR PREDICTION METHOD OF THERMOSETTING RESIN, SIMULATION SOFTWARE, MANUFACTURING METHOD OF THERMOSETTING RESIN, AND UNDERFILL MANUFACTURED BY THIS MANUFACTURING METHOD
SATO TOSHIYUKI, HOSHIYAMA MASAAKI, HAYASHIGAKI ARATA, HOCCHI TOYOKAZU, ENOMOTO TOSHIAKI
Year of Publication 13.11.2014
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Year of Publication 13.11.2014
Patent
Measurement of Poisson's Ratio of Resin Materials
Yamaguchi, Hiroshi, Enomoto, Toshiaki, Fujita, Takayuki
Published in 2021 IEEE CPMT Symposium Japan (ICSJ) (10.11.2021)
Published in 2021 IEEE CPMT Symposium Japan (ICSJ) (10.11.2021)
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Conference Proceeding
Measurement and Analysis of Neutron Emission Rate for Irradiated BWR Fuel
YOKOYAMA, Tsutomu, UEDA, Makoto, KUROSAWA, Fumio, ENOMOTO, Toshiaki
Published in Journal of nuclear science and technology (01.04.1981)
Published in Journal of nuclear science and technology (01.04.1981)
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Journal Article
A New Method of Startup Planning for Boiling Water Reactors
BESSHO, Yasunori, MOTODA, Hiroshi, KIGUCHI, Takashi, HAYASE, Tamotsu, HOSHI, Kazuo, ENOMOTO, Toshiaki
Published in Journal of nuclear science and technology (01.09.1981)
Published in Journal of nuclear science and technology (01.09.1981)
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Journal Article
Stress variation analysis during curing process of epoxy underfill
Yamaguchi, Hiroshi, Enomoto, Toshiaki, Sato, Toshiyuki
Published in 2014 International Conference on Electronics Packaging (ICEP) (01.04.2014)
Published in 2014 International Conference on Electronics Packaging (ICEP) (01.04.2014)
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Conference Proceeding