Slow slip source characterized by lithological and geometric heterogeneity
Barnes, Philip M, Wallace, Laura M, Saffer, Demian M, Bell, Rebecca E, Underwood, Michael B, Fagereng, Ake, Meneghini, Francesca, Savage, Heather M, Rabinowitz, Hannah S, Morgan, Julia K, Kitajima, Hiroko, Kutterolf, Steffen, Hashimoto, Yoshitaka, Engelmann de Oliveira, Christie H, Noda, Atsushi, Crundwell, Martin P, Shepherd, Claire L, Woodhouse, Adam D, Harris, Robert N, Wang, Maomao, Henrys, Stuart, Barker, Daniel H N, Petronotis, Katerina E, Bourlange, Sylvain M, Clennell, Michael B, Cook, Ann E, Dugan, Brandon E, Elger, Judith, Fulton, Patrick M, Gamboa, Davide, Greve, Annika, Han, Shuoshuo, Hüpers, Andre, Ikari, Matt J, Ito, Yoshihiro, Kim, Gil Young, Koge, Hiroaki, Lee, Hikweon, Li, Xuesen, Luo, Min, Malie, Pierre R, Moore, Gregory F, Mountjoy, Joshu J, McNamara, David D, Paganoni, Matteo, Screaton, Elizabeth J, Shankar, Uma, Shreedharan, Srisharan, Solomon, Evan A, Wang, Xiujuan, Wu, Hung-Yu, Pecher, Ingo A, LeVay, Leah J
Published in Science advances (01.03.2020)
Published in Science advances (01.03.2020)
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Journal Article
Ba4Al2Ti10O27 based glass ceramic as dielectric in high frequency applications
Letz, M., Hovhannisyan, M., Bergmann, F., Bai, Xiaofei, Engelmann, H., Weidmann, G.
Published in Applied physics letters (02.08.2021)
Published in Applied physics letters (02.08.2021)
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Journal Article
The National Human Activity Pattern Survey (NHAPS): a resource for assessing exposure to environmental pollutants
Klepeis, N E, Nelson, W C, Ott, W R, Robinson, J P, Tsang, A M, Switzer, P, Behar, J V, Hern, S C, Engelmann, W H
Published in Journal of exposure analysis and environmental epidemiology (01.05.2001)
Published in Journal of exposure analysis and environmental epidemiology (01.05.2001)
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Journal Article
CMOS-compatible manufacturability of sub-15 nm Si/SiO2/Si nanopillars containing single Si nanodots for single electron transistor applications
von Borany, J, Engelmann, H-J, Heinig, K-H, Amat, E, Hlawacek, G, Klüpfel, F, Hübner, R, Möller, W, Pourteau, M-L, Rademaker, G, Rommel, M, Baier, L, Pichler, P, Perez-Murano, F, Tiron, R
Published in Semiconductor science and technology (01.05.2023)
Published in Semiconductor science and technology (01.05.2023)
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Journal Article
CMOS compatible manufacturing of a hybrid SET-FET circuit
del Moral, A, Amat, E, Engelmann, H-J, Pourteau, M-L, Rademaker, G, Quirion, D, Torres-Herrero, N, Rommel, M, Heinig, K-H, von Borany, J, Tiron, R, Bausells, J, Perez-Murano, F
Published in Semiconductor science and technology (01.12.2022)
Published in Semiconductor science and technology (01.12.2022)
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Journal Article
Modeling crack propagation for advanced 4-point bending testing of metal–dielectric thin film stacks
Gadelrab, K.R., Chiesa, M., Hecker, M., Engelmann, H.-J.
Published in Engineering fracture mechanics (01.12.2012)
Published in Engineering fracture mechanics (01.12.2012)
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Journal Article
Sub-20 nm multilayer nanopillar patterning for hybrid SET/CMOS integration
Pourteau, M.-L., Gharbi, A., Brianceau, P., Dallery, J.-A., Laulagnet, F., Rademaker, G., Tiron, R., Engelmann, H.-J., von Borany, J., Heinig, K.-H., Rommel, M., Baier, L.
Published in Micro and Nano Engineering (01.11.2020)
Published in Micro and Nano Engineering (01.11.2020)
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Journal Article
Atomic layer deposition of nanolaminate oxide films on Si
Tallarida, M., Weisheit, M., Kolanek, K., Michling, M., Engelmann, H. J., Schmeisser, D.
Published in Journal of nanoparticle research : an interdisciplinary forum for nanoscale science and technology (01.11.2011)
Published in Journal of nanoparticle research : an interdisciplinary forum for nanoscale science and technology (01.11.2011)
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Journal Article
Effect of nitrogen content on the degradation mechanisms of thin Ta–Si–N diffusion barriers for Cu metallization
Hübner, R., Hecker, M., Mattern, N., Hoffmann, V., Wetzig, K., Heuer, H., Wenzel, Ch, Engelmann, H.-J., Gehre, D., Zschech, E.
Published in Thin solid films (03.04.2006)
Published in Thin solid films (03.04.2006)
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Journal Article
Immunogenicity of a monovalent, aluminum-adjuvanted influenza whole virus vaccine for pandemic use
Hehme, N, Engelmann, H, Kuenzel, W, Neumeier, E, Saenger, R
Published in Virus research (01.07.2004)
Published in Virus research (01.07.2004)
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Journal Article
Structure and thermal stability of graded Ta-TaN diffusion barriers between Cu and SiO2
HÜBNER, R, HECKER, M, MATTERN, N, HOFFMANN, V, WETZIG, K, WENGER, Ch, ENGELMANN, H.-J, WENZEL, Ch, ZSCHECH, E, BARTHA, J. W
Published in Thin solid films (01.08.2003)
Published in Thin solid films (01.08.2003)
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Journal Article
Measuring the dielectric constant of materials from valence EELS
Potapov, P.L., Engelmann, H.-J., Zschech, E., Stöger-Pollach, M.
Published in Micron (Oxford, England : 1993) (01.02.2009)
Published in Micron (Oxford, England : 1993) (01.02.2009)
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Journal Article
Influence of nitrogen content on the crystallization behavior of thin Ta–Si–N diffusion barriers
Hübner, R., Hecker, M., Mattern, N., Voss, A., Acker, J., Hoffmann, V., Wetzig, K., Engelmann, H.-J., Zschech, E., Heuer, H., Wenzel, Ch
Published in Thin solid films (01.12.2004)
Published in Thin solid films (01.12.2004)
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Journal Article
Pandemic preparedness: lessons learnt from H2N2 and H9N2 candidate vaccines
Hehme, N, Engelmann, H, Künzel, W, Neumeier, E, Sänger, R
Published in Medical microbiology and immunology (01.12.2002)
Published in Medical microbiology and immunology (01.12.2002)
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