Search Results - "ELSHERBINI ADEL" :: K.UTB vyhledávací portál | TBU Library Retrieval Portal

Mapping of Sand Layer Thickness in Deserts Using SAR Interferometry

Mapping of Sand Layer Thickness in Deserts Using SAR Interferometry

by Elsherbini, A, Sarabandi, K
Published in IEEE transactions on geoscience and remote sensing (01.09.2010)

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Journal Article

Circuit Modeling of Nonlinear Lossy Frequency-Dependent Thin-Film Magnetic Inductors

Circuit Modeling of Nonlinear Lossy Frequency-Dependent Thin-Film Magnetic Inductors

by Elsherbini, Adel, Braunisch, Henning, O'Brien, Kevin, Hill, Michael J.
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.01.2014)

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Journal Article

Image Distortion Effects in SAR Subsurface Imaging and a New Iterative Approach for Refocusing and Coregistration

Image Distortion Effects in SAR Subsurface Imaging and a New Iterative Approach for Refocusing and Coregistration

by Elsherbini, Adel, Sarabandi, Kamal
Published in IEEE transactions on geoscience and remote sensing (01.05.2014)

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Journal Article

Dual Polarized Wideband Directional Coupled Sectorial Loop Antennas for Radar and Mobile Base-Station Applications

Dual Polarized Wideband Directional Coupled Sectorial Loop Antennas for Radar and Mobile Base-Station Applications

by Elsherbini, Adel, Jiangfeng Wu, Sarabandi, Kamal
Published in IEEE transactions on antennas and propagation (01.04.2015)

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Journal Article

Dual-Polarized Coupled Sectorial Loop Antennas for UWB Applications

Dual-Polarized Coupled Sectorial Loop Antennas for UWB Applications

by Elsherbini, Adel, Sarabandi, Kamal
Published in IEEE antennas and wireless propagation letters (2011)

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Journal Article

$Scaling Solder Micro-Bump Interconnect Down to 10\ \mu\mathrm Pitch for Advanced 3D IC Packages$

Scaling Solder Micro-Bump Interconnect Down to 10\ \mu\mathrm Pitch for Advanced 3D IC Packages

by Li, Zhaozhi, Tomita, Yoshihiro, Elsherbini, Adel A., Liu, Pilin, Sawyer, Holly A., Swan, Johanna M., Liff, Shawna M.
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)

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Conference Proceeding

MICROELECTRONIC ASSEMBLIES

MICROELECTRONIC ASSEMBLIES

by SWAN JOHANNA M, ELSHERBINI ADEL A, LIFF SHAWNA M
Year of Publication 12.01.2024

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Patent

MICROELECTRONIC ASSEMBLIES

MICROELECTRONIC ASSEMBLIES

by LIFF SHAWNA, SWAN JOHANNA M, ELSHERBINI ADEL A, EID FERAS
Year of Publication 31.10.2023

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Patent

(Invited, Digital Presentation) Overview of Current and Future 3D Heterogeneous Integration Architectures

(Invited, Digital Presentation) Overview of Current and Future 3D Heterogeneous Integration Architectures

by Elsherbini, Adel
Published in Meeting abstracts (Electrochemical Society) (22.12.2023)

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Journal Article

Compact Directive Ultra-Wideband Rectangular Waveguide Based Antenna for Radar and Communication Applications

Compact Directive Ultra-Wideband Rectangular Waveguide Based Antenna for Radar and Communication Applications

by Elsherbini, A., Sarabandi, K.
Published in IEEE transactions on antennas and propagation (01.05.2012)

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Journal Article

ENVELOP Antenna: A Class of Very Low Profile UWB Directive Antennas for Radar and Communication Diversity Applications

by Elsherbini, A., Sarabandi, K.
Published in IEEE transactions on antennas and propagation (01.03.2013)

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Journal Article

BEOL SELECTIVE INTERCONNECTS IN BACK-END-OF-LINE METALLIZATION STACKS OF INTEGRATED CIRCUITRY

BEOL SELECTIVE INTERCONNECTS IN BACK-END-OF-LINE METALLIZATION STACKS OF INTEGRATED CIRCUITRY

by ELSHERBINI ADEL, LIFF SHAWNA, SWAN JOHANNA
Year of Publication 03.06.2021

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Patent

MICROELECTRONIC ASSEMBLIES

MICROELECTRONIC ASSEMBLIES

by LIFF SHAWNA, SWAN JOHANNA M, ELSHERBINI ADEL A, EID FERAS
Year of Publication 20.01.2023

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Patent

SCALABLE EMBEDDED SILICON BRIDGE VIA PILLARS IN LITHOGRAPHICALLY DEFINED VIAS AND METHODS OF MAKING SAME

SCALABLE EMBEDDED SILICON BRIDGE VIA PILLARS IN LITHOGRAPHICALLY DEFINED VIAS AND METHODS OF MAKING SAME

by SOTO GONZALEZ JAVIER, BRAUNISCH HENNING, ELSHERBINI ADEL A, LIFF SHAWNA M
Year of Publication 30.04.2024

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Patent

후면 다이 대 패키지 인터커넥트들을 갖는 마이크로전자 어셈블리들

후면 다이 대 패키지 인터커넥트들을 갖는 마이크로전자 어셈블리들

by ELSHERBINI ADEL, THEN HAN WAN, LIFF SHAWNA, JUN KIMIN, SWAN JOHANNA
Year of Publication 24.04.2024

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Patent

(Invited) Advancing 3D Packaging for Heterogenous Systems Integration

(Invited) Advancing 3D Packaging for Heterogenous Systems Integration

by Elsherbini, Adel
Published in Meeting abstracts (Electrochemical Society) (09.10.2022)

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Journal Article

HEAT DISSIPATION DEVICE HAVING A THERMALLY CONDUCTIVE STRUCTURE AND A THERMAL ISOLATION STRUCTURE IN THE THERMALLY CONDUCTIVE STRUCTURE

HEAT DISSIPATION DEVICE HAVING A THERMALLY CONDUCTIVE STRUCTURE AND A THERMAL ISOLATION STRUCTURE IN THE THERMALLY CONDUCTIVE STRUCTURE

by ELSHERBINI ADEL, SWAN JOHANNA, EID FERAS
Year of Publication 29.10.2019

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Patent

HEAT DISSIPATION DEVICE HAVING ANISOTROPIC THERMALLY CONDUCTIVE SECTIONS AND ISOTROPIC THERMALLY CONDUCTIVE SECTIONS

HEAT DISSIPATION DEVICE HAVING ANISOTROPIC THERMALLY CONDUCTIVE SECTIONS AND ISOTROPIC THERMALLY CONDUCTIVE SECTIONS

by ELSHERBINI ADEL, SWAN JOHANNA, EID FERAS
Year of Publication 29.10.2019

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Patent

RECONSTITUTED WAFER ASSEMBLY

RECONSTITUTED WAFER ASSEMBLY

by ELSHERBINI ADEL, LIFF SHAWNA, BRAUNISCH HENNING, SWAN JOHANNA
Year of Publication 16.06.2021

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Patent

COMPOSITE INTERPOSER STRUCTURE AND METHOD OF PROVIDING SAME

COMPOSITE INTERPOSER STRUCTURE AND METHOD OF PROVIDING SAME

by ELSHERBINI ADEL, LIFF SHAWNA, SWAN JOHANNA, PASDAST GERALD
Year of Publication 04.06.2021

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Patent

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