Arrangement for treatment of substrates e.g. wafers during the finishing of electronic and microelectronic components comprises substrate support plates arranged over each other in a vacuum chamber
GESCHE, ROLAND, WETTE, FRANK, SCHACHLER, EDGAR, TOBIES, HARALD, IMBERGER, TOBIAS, KESSLER, LUTZ, ELSDOERFER, RALF, KOVACS, REINHOLD, SELMECZI, SANDOR, KESSLER, CHRISTIAN
Year of Publication 22.02.2001
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Year of Publication 22.02.2001
Patent
Structured coating process used in metallizing processes comprises applying a material to a substrate, covering the substrate and the material with a coating and then removing the material together with the coating
GESCHE, ROLAND, SCHACHLER, EDGAR, WETTE, FRANK, IMBERGER, TOBIAS, ELSDOERFER, RALF, PANHANS, BARBARA, TOBICS, HARALD, KESLER, CHRISTIAN, KOVACS, REINHOLD, SELMECZI, SANDOR
Year of Publication 27.07.2000
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Year of Publication 27.07.2000
Patent