Design and analysis of a scheme to mitigate condensation on an assembly used to cool a processor module
Ellsworth, M J, Schmidt, R R, Agonafer, S
Published in IBM journal of research and development (01.11.2002)
Published in IBM journal of research and development (01.11.2002)
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Journal Article
A high density, high performance MCM-D/C package: a design, electrical, and process perspective
Ellsworth, M.J., Hamel, H., Perfecto, E.D., Wassick, T.
Published in 1996 Proceedings 46th Electronic Components and Technology Conference (1996)
Published in 1996 Proceedings 46th Electronic Components and Technology Conference (1996)
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Conference Proceeding
Journal Article
Quinoxaline-Based Poly(aryleneethynylene)s
Bangcuyo, Carlito G, Ellsworth, Joe M, Evans, Una, Myrick, Michael L, Bunz, Uwe H. F
Published in Macromolecules (11.02.2003)
Published in Macromolecules (11.02.2003)
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Journal Article
Review of cooling technologies for computer products
Chu, R.C., Simons, R.E., Ellsworth, M.J., Schmidt, R.R., Cozzolino, V.
Published in IEEE transactions on device and materials reliability (01.12.2004)
Published in IEEE transactions on device and materials reliability (01.12.2004)
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Magazine Article
Formation of Hexagonal Coordination Complexes
Schultheiss, Nate, Ellsworth, Joseph M., Bosch, Eric, Barnes, Charles L.
Published in European journal of inorganic chemistry (01.01.2005)
Published in European journal of inorganic chemistry (01.01.2005)
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Journal Article
The evolution of water cooling for IBM large server systems: Back to the future
Ellsworth, M.J., Campbell, L.A., Simons, R.E., Iyengar, M.K., Schmidt, R.R., Chu, R.C.
Published in 2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (01.05.2008)
Published in 2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (01.05.2008)
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Conference Proceeding