Repairability of underfill encapsulated flip-chip packages
Suryanarayana, D., Varcoe, J.A., Ellerson, J.V.
Published in 1995 Proceedings. 45th Electronic Components and Technology Conference (1995)
Published in 1995 Proceedings. 45th Electronic Components and Technology Conference (1995)
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Conference Proceeding
Journal Article
Apparatus and method for selectively etching a plastic encapsulating material
KONRAD, III; LOUIS J, ELLERSON; JAMES V, VARCOE; JACK A, MOORE; RONALD J
Year of Publication 12.10.1993
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Year of Publication 12.10.1993
Patent
Method of making an electronic package assembly with protective encapsulant material
ELLERSON; JAMES V, VETTEL; GERALD M, BONITZ; BARRY A, KAPUR; KISHEN N, MCCREARY; JACK M, MEMIS; IRVING
Year of Publication 16.05.1995
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Year of Publication 16.05.1995
Patent
Providing circuit lines on a substrate
LAFER; WILLIAM, ELLERSON; JAMES V, DONSON; WILLIAM A, SNYDER; KEITH A, HAMMER; RICHARD B
Year of Publication 01.09.1987
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Year of Publication 01.09.1987
Patent