Search Results - "EJIRI YOSHINORI" :: K.UTB vyhledávací portál

Proposal of Ultrafine and High Reliable Trench Wiring Process for Organic Interposer

by Mitsukura, Kazuyuki, Toba, Masaya, Urashima, Kousuke, Ejiri, Yoshinori, Iwashita, Kenichi, Minegishi, Tomonori, Kurafuchi, Kazuhiko
Published in Journal of microelectronics and electronic packaging (01.01.2017)

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Journal Article

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METHOD FOR MANUFACTURING ELECTROCONDUCTIVE-VIA-EQUIPPED SUBSTRATE, ELECTROCONDUCTIVE-VIA-EQUIPPED SUBSTRATE, AND METAL PASTE

by NAKAKO Hideo, SAKAMOTO Masumi, EJIRI Yoshinori, SUKATA Shinichirou, SHIMIZU Chiaki
Year of Publication 19.09.2024

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Patent

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METHOD FOR MANUFACTURING SUBSTRATE WITH CONDUCTIVE VIA, AND METHOD FOR MANUFACTURING WIRING SUBSTRATE WITH CONDUCTIVE VIA

by NAKAKO Hideo, SAKAMOTO Masumi, EJIRI Yoshinori, SUKATA Shinichirou, SHIMIZU Chiaki
Year of Publication 19.09.2024

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Patent

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CONDUCTIVE ADHESIVE COMPOSITION, ORGANIC ELECTRONICS DEVICE, AND METHOD FOR MANUFACTURING ORGANIC ELECTRONICS DEVICE

by SUGATA SHINICHIRO, EJIRI YOSHINORI, AKAI KUNIHIKO
Year of Publication 15.09.2022

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Patent

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접합용 금속 페이스트, 및 접합체 및 그 제조 방법

by NATORI MICHIKO, NAKAKO HIDEO, EJIRI YOSHINORI, ISHIKAWA DAI, TANAKA TOSHIAKI
Year of Publication 12.03.2024

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Patent

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접합용 금속 페이스트, 및 접합체 및 그 제조 방법

by NATORI MICHIKO, NAKAKO HIDEO, EJIRI YOSHINORI, ISHIKAWA DAI, TANAKA TOSHIAKI
Year of Publication 07.03.2024

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Patent

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ELECTRONIC COMPONENT DEVICE AND MANUFACTURING METHOD THEREOF

by EJIRI YOSHINORI, MASUDA HIROSHI, YAMAGISHI HIDEAKI
Year of Publication 23.06.2022

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Patent

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SUBSTRATE FOR SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING SUBSTRATE FOR SEMICONDUCTOR PACKAGE

by TOBA MASAYA, EJIRI YOSHINORI, KURABUCHI KAZUHIKO, MITSUKURA KAZUYUKI
Year of Publication 01.02.2024

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Patent

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ARTICLE MANUFACTURING METHOD

by EJIRI YOSHINORI, NODO TAKAAKI, YONEKURA GENKI
Year of Publication 02.03.2022

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Patent

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땜납 범프 부착 부재의 제조 방법, 땜납 범프 부착 부재, 및 땜납 범프 형성용 부재

by KAKEHATA JUNICHI, YOSHIBA AYUMI, EJIRI YOSHINORI, AKAI KUNIHIKO
Year of Publication 10.10.2023

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Patent

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METAL PASTE FOR JOINING, JOINT, AND MANUFACTURING METHOD THEREFOR

by NAKAKO Hideo, EJIRI Yoshinori, TANAKA Toshiaki, NATORI Michiko, ISHIKAWA Dai
Year of Publication 12.01.2023

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Patent

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METAL PASTE FOR BONDING, AND BONDED BODY AND METHOD FOR PRODUCING SAME

by NAKAKO Hideo, EJIRI Yoshinori, TANAKA Toshiaki, NATORI Michiko, ISHIKAWA Dai
Year of Publication 12.01.2023

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Patent

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MANUFACTURING METHOD OF CIRCUIT MEMBER WITH COPPER PILLAR AND MANUFACTURING METHOD OF CONJUGATE

by NATORI MICHIKO, ISHIKAWA MASARU, EJIRI YOSHINORI, NAKAKO TAKEO, TANAKA TOSHIAKI
Year of Publication 08.12.2022

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Patent

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MANUFACTURING METHOD OF ARTICLE

by EJIRI YOSHINORI, NODO TAKAAKI, YONEKURA GENKI
Year of Publication 04.03.2021

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Patent

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ARTICLE MANUFACTURING METHOD AND COMPOSITION FOR FORMING METAL SINTERED BODY LAYER

by EJIRI YOSHINORI, NODO TAKAAKI, YONEKURA GENKI
Year of Publication 04.03.2021

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Patent

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METHOD OF MANUFACTURING ARTICLE HAVING CONDUCTOR LAYER

by EJIRI YOSHINORI, NODO TAKAAKI, YONEKURA GENKI
Year of Publication 12.02.2021

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Patent

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METAL PARTICLE FILM, METHOD FOR MANUFACTURING METAL PARTICLE FILM, AND METHOD FOR MANUFACTURING SUBSTRATE HAVING THROUGH ELECTRODE

by EJIRI YOSHINORI, SUGATA SHINICHIRO, NISHIDA KAZUHIRO, SAKAMOTO MASUMI, YATABE TSUYOSHI, NAKAKO TAKEO, YONEKURA GENKI
Year of Publication 21.06.2024

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Patent