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Carta, Fabio, Gates, Stephen M., Limanov, Alexander B., Im, James S., Edelstein, Daniel C., Kymissis, Ioannis
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Published in IEEE transactions on electron devices (01.11.2015)
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Published in 2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC) (01.05.2016)
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Conference Proceeding
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20 Years of Cu BEOL in manufacturing, and its future prospects
Edelstein, Daniel C.
Published in 2017 IEEE International Electron Devices Meeting (IEDM) (01.12.2017)
Published in 2017 IEEE International Electron Devices Meeting (IEDM) (01.12.2017)
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Conference Proceeding
METHOD FOR PREPARING CONDUCTIVE PAD FOR ELECTRICAL CONNECTION AND FORMED CONDUCTIVE PAD
JOHN G. GAUDEIERO, JUDETH M. RUBINO, EDELSTEIN DANIEL C, CARLOS J. SAMUBUSETTEI, GEORGE WALKER
Year of Publication 31.08.2001
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Year of Publication 31.08.2001
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METHOD OF FORMING COPPER INTERCONNECT STRUCTURE WITH MANGANESE BARRIER LAYER
Shobha, Hosadurga, Priyadarshini, Deepika, Nguyen, Son V, Edelstein, Daniel C, Nogami, Takeshi
Year of Publication 04.01.2024
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Year of Publication 04.01.2024
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Method of forming copper interconnect structure with manganese barrier layer
Shobha, Hosadurga, Priyadarshini, Deepika, Nguyen, Son V, Edelstein, Daniel C, Nogami, Takeshi
Year of Publication 31.10.2023
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Year of Publication 31.10.2023
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