Low-Loss, High-Linearity RF Interposers Enabled by Through Glass Vias
Shah, Umer, Liljeholm, Jessica, Campion, James, Ebefors, Thorbjorn, Oberhammer, Joachim
Published in IEEE microwave and wireless components letters (01.11.2018)
Published in IEEE microwave and wireless components letters (01.11.2018)
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Journal Article
Through-Glass Vias for Glass Interposers and MEMS Packaging Applications Fabricated Using Magnetic Assembly of Microscale Metal Wires
Laakso, Miku J., Bleiker, Simon J., Liljeholm, Jessica, Martensson, Gustaf E., Asiatici, Mikhail, Fischer, Andreas C., Stemme, Goran, Ebefors, Thorbjorn, Niklaus, Frank
Published in IEEE access (01.01.2018)
Published in IEEE access (01.01.2018)
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Journal Article
Design and Fabrication of Addressable Microfluidic Energy Storage MEMS Device
Lifton, V. A., Simon, S., Holmqvist, J., Ebefors, T., Jansson, D., Svedin, N.
Published in Journal of microelectromechanical systems (01.12.2012)
Published in Journal of microelectromechanical systems (01.12.2012)
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Journal Article
Through-Silicon Vias and 3D Inductors for RF Applications
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Trade Publication Article
Journal Article
The development and evaluation of RF TSV for 3D IPD applications
Ebefors, Thorbjorn, Fredlund, Jessica, Perttu, Daniel, van Dijk, Raymond, Cifola, Lorenzo, Kaunisto, Mikko, Rantakari, Pekka, Vaha-Heikkila, Tauno
Published in 2013 IEEE International 3D Systems Integration Conference (3DIC) (01.10.2013)
Published in 2013 IEEE International 3D Systems Integration Conference (3DIC) (01.10.2013)
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Conference Proceeding
Maskless manufacturing of through glass vias (TGVS) and their test structures
Laakso, Miku J., Liljeholm, Jessica, Fischer, Andreas C., Stemme, Goran, Ebefors, Thorbjorn, Niklaus, Frank
Published in 2017 IEEE 30th International Conference on Micro Electro Mechanical Systems (MEMS) (01.01.2017)
Published in 2017 IEEE 30th International Conference on Micro Electro Mechanical Systems (MEMS) (01.01.2017)
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Conference Proceeding
Dynamic actuation of polyimide V-groove joints by electrical heating
Ebefors, Thorbjörn, Kälvesten, Edvard, Stemme, Göran
Published in Sensors and actuators. A, Physical (15.05.1998)
Published in Sensors and actuators. A, Physical (15.05.1998)
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Journal Article
Conference Proceeding
Inkjet printing technology for increasing the I/O density of 3D TSV interposers
Khorramdel, Behnam, Liljeholm, Jessica, Laurila, Mika-Matti, Lammi, Toni, Mårtensson, Gustaf, Ebefors, Thorbjörn, Niklaus, Frank, Mäntysalo, Matti
Published in Microsystems & nanoengineering (2017)
Published in Microsystems & nanoengineering (2017)
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Journal Article