Characterization and modeling of oxide chemical-mechanical polishing using planarization length and pattern density concepts
Ouma, D.O., Boning, D.S., Chung, J.E., Easter, W.G., Saxena, V., Misra, S., Crevasse, A.
Published in IEEE transactions on semiconductor manufacturing (01.05.2002)
Published in IEEE transactions on semiconductor manufacturing (01.05.2002)
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Journal Article
Polishing surface temperature conditioning system for a chemical mechanical planarization process
MICELI FRANK, YAN YIFENG W, EASTER WILLIAM G, CREVASSE ANNETTE M, MAZE JOHN A
Year of Publication 04.02.2002
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Year of Publication 04.02.2002
Patent