Search Results - "Dušek, Karel" :: K.UTB vyhledávací portál | TBU Library Retrieval Portal

A Novel Approach for Temperature-Induced Ball Grid Array Collapse Observation

A Novel Approach for Temperature-Induced Ball Grid Array Collapse Observation

by Sorokina, Kristina, Dušek, Karel, Bušek, David
Published in Materials (02.06.2024)

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Journal Article

Influence of Solder Mask on Electrochemical Migration on Printed Circuit Boards

Influence of Solder Mask on Electrochemical Migration on Printed Circuit Boards

by Klimtová, Markéta, Veselý, Petr, Králová, Iva, Dušek, Karel
Published in Materials (01.09.2024)

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Journal Article

How to Force Polymer Gels to Show Volume Phase Transitions

How to Force Polymer Gels to Show Volume Phase Transitions

by Dušková-Smrčková, Miroslava, Dušek, Karel
Published in ACS macro letters (19.03.2019)

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Journal Article

The influence of the crystallographic structure of the intermetallic grains on tin whisker growth

The influence of the crystallographic structure of the intermetallic grains on tin whisker growth

by Illés, Balázs, Skwarek, Agata, Ratajczak, Jacek, Dušek, Karel, Bušek, David
Published in Journal of alloys and compounds (15.05.2019)

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Journal Article

Influence of Manufacturing Mechanical and Thermal Histories on Dimensional Stabilities of FR4 Laminate and FR4/Cu-Plated Holes

Influence of Manufacturing Mechanical and Thermal Histories on Dimensional Stabilities of FR4 Laminate and FR4/Cu-Plated Holes

by Rudajevová, Alexandra, Dušek, Karel
Published in Materials (28.10.2018)

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Journal Article

Volume Phase Transition in Gels: Its Discovery and Development

Volume Phase Transition in Gels: Its Discovery and Development

by Dušek, Karel, Dušková-Smrčková, Miroslava
Published in Gels (31.07.2020)

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Journal Article

Investigation of Impacts on Printed Circuit Board Laminated Composites Caused by Surface Finish Application

Investigation of Impacts on Printed Circuit Board Laminated Composites Caused by Surface Finish Application

by Froš, Denis, Dušek, Karel, Veselý, Petr
Published in Polymers (22.09.2021)

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Journal Article

Dielectric spectroscopy of PETG/TiO2 composite intended for 3D printing

Dielectric spectroscopy of PETG/TiO2 composite intended for 3D printing

by Veselý, Petr, Froš, Denis, Hudec, Tomáš, Sedláček, Josef, Ctibor, Pavel, Dušek, Karel
Published in Virtual and physical prototyping (31.12.2023)

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Journal Article

Filtering Efficiency of Sustainable Textile Materials Applied in Personal Protective Face Mask Production during Pandemic

Filtering Efficiency of Sustainable Textile Materials Applied in Personal Protective Face Mask Production during Pandemic

by Géczy, Attila, Havellant, Gergő, Bátorfi, Réka, Skwarek, Agata, Dušek, Karel, Bušek, David, Illés, Balázs
Published in Materials (17.01.2023)

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Journal Article

Influence of Flux and Related Factors on Intermetallic Layer Growth within SAC305 Solder Joints

Influence of Flux and Related Factors on Intermetallic Layer Growth within SAC305 Solder Joints

by Dušek, Karel, Veselý, Petr, Bušek, David, Petráč, Adam, Géczy, Attila, Illés, Balázs, Krammer, Oliver
Published in Materials (20.12.2021)

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Journal Article

Protective Coatings: Film Formation and Properties

Protective Coatings: Film Formation and Properties

by Wen, Mei, Dusek, Karel
Year of Publication 2017

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eBook

Constrained Swelling of Polymer Networks: Characterization of Vapor-Deposited Cross-Linked Polymer Thin Films

Constrained Swelling of Polymer Networks: Characterization of Vapor-Deposited Cross-Linked Polymer Thin Films

by Dušek, Karel, Choukourov, Andrei, Dušková-Smrčková, Miroslava, Biederman, Hynek
Published in Macromolecules (08.07.2014)

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Journal Article

Suppression of Sn whisker growth from SnAgCu solder alloy with TiO2 and ZnO reinforcement nano-particles by increasing the corrosion resistance of the composite alloy

Suppression of Sn whisker growth from SnAgCu solder alloy with TiO2 and ZnO reinforcement nano-particles by increasing the corrosion resistance of the composite alloy

by Illés, Balázs, Choi, Halim, Hurtony, Tamás, Dušek, Karel, Bušek, David, Skwarek, Agata
Published in Journal of materials research and technology (01.09.2022)

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Journal Article

Mathematical Modelling of Temperature Distribution in Selected Parts of FFF Printer during 3D Printing Process

Mathematical Modelling of Temperature Distribution in Selected Parts of FFF Printer during 3D Printing Process

by Tichý, Tomáš, Šefl, Ondřej, Veselý, Petr, Dušek, Karel, Bušek, David
Published in Polymers (01.12.2021)

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Journal Article

Effect of Cu Substrate Roughness and Sn Layer Thickness on Whisker Development from Sn Thin-Films

Effect of Cu Substrate Roughness and Sn Layer Thickness on Whisker Development from Sn Thin-Films

by Illés, Balázs, Hurtony, Tamás, Krammer, Olivér, Medgyes, Bálint, Dušek, Karel, Bušek, David
Published in Materials (03.11.2019)

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Journal Article

Effect of Recrystallization on β to α-Sn Allotropic Transition in 99.3Sn-0.7Cu wt. % Solder Alloy Inoculated with InSb

Effect of Recrystallization on β to α-Sn Allotropic Transition in 99.3Sn-0.7Cu wt. % Solder Alloy Inoculated with InSb

by Skwarek, Agata, Illés, Balázs, Hurtony, Tamás, Bušek, David, Dušek, Karel
Published in Materials (21.02.2020)

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Journal Article

Investigation of the Mechanical Properties of Mn-Alloyed Tin-Silver-Copper Solder Solidified with Different Cooling Rates

Investigation of the Mechanical Properties of Mn-Alloyed Tin-Silver-Copper Solder Solidified with Different Cooling Rates

by Hurtony, Tamás, Krammer, Oliver, Illés, Balázs, Harsányi, Gábor, Bušek, David, Dušek, Karel
Published in Materials (20.11.2020)

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Journal Article

Arbuscular mycorrhiza differentially affects synthesis of essential oils in coriander and dill

Arbuscular mycorrhiza differentially affects synthesis of essential oils in coriander and dill

by Rydlova, Jana, Jelinkova, Marcela, Dusek, Karel, Duskova, Elena, Vosatka, Miroslav, Pueschel, David
Published in Mycorrhiza (01.02.2016)

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Journal Article

Latent heat induced deformation of PCB substrate: Measurement and simulation

Latent heat induced deformation of PCB substrate: Measurement and simulation

by Froš, Denis, Veselý, Petr, Zemen, Jan, Dušek, Karel
Published in Case studies in thermal engineering (01.08.2022)

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Journal Article

Understanding the Effect of Reflow Profile on the Metallurgical Properties of Tin–Bismuth Solders

by Dušek, Karel, Bušek, David, Veselý, Petr, Pražanová, Anna, Plaček, Martin, Re, Julia Del
Published in Metals (Basel ) (01.01.2022)

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Journal Article

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