Mercury Liquid Embrittlement Failure of 5083-O Aluminum Alloy Piping
English, Jerome J., Duquette, David J.
Published in Journal of failure analysis and prevention (01.10.2022)
Published in Journal of failure analysis and prevention (01.10.2022)
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Journal Article
In situ EC-TEM Studies of Metal Thin Film Corrosion in Liquid Solutions at Elevated Temperatures
Park, Jeung Hun, Watanabe, Tommy, Pinkowitz, Ainsley, Duquette, David J., Hull, Robert, Steingart, Daniel A., Ross, Frances M.
Published in Microscopy and microanalysis (01.08.2018)
Published in Microscopy and microanalysis (01.08.2018)
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Journal Article
Stress behavior of electrodeposited copper films as mechanical supporters for light emitting diodes
Kim, Sunjung, Jang, Jun-Ho, Lee, Jeong-Soo, Duquette, David J.
Published in Electrochimica acta (01.04.2007)
Published in Electrochimica acta (01.04.2007)
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Journal Article
Intergranular Attack of Low Carbon Steel in Molten Aluminum Chloride
Lu, Mingquan, Leman, John, Lewis, Daniel, Duquette, David
Published in Journal of the Electrochemical Society (01.05.2024)
Published in Journal of the Electrochemical Society (01.05.2024)
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Journal Article
Efficient Polymerization of Aniline at Carbon Nanotube Electrodes
Downs, Christine, Nugent, John, Ajayan, Pulickel M., Duquette, David J., Santhanam, Kalathur S. V.
Published in Advanced materials (Weinheim) (01.08.1999)
Published in Advanced materials (Weinheim) (01.08.1999)
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Journal Article
Seedless electrochemical deposition of copper on physical vapor deposition-W2N liner materials for ultra large scale integration (ULSI) devices
SHAW, Michael J, GRUNOW, Stephan, DUQUETTE, David J
Published in Journal of electronic materials (01.12.2001)
Published in Journal of electronic materials (01.12.2001)
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Conference Proceeding
Journal Article
Mass transfer models for the electrodeposition of copper with a buffering agent
GILL, William N, DUQUETTE, David J, VARADARAJAN, Desikan
Published in Journal of the Electrochemical Society (01.04.2001)
Published in Journal of the Electrochemical Society (01.04.2001)
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Journal Article
A tertiary current distribution model for the pulse plating of copper into high aspect ratio sub-0.25 μm trenches
VARADARAJAN, Desikan, LEE, Charles Y, KRISHNAMOORTHY, Ahila, DUQUETTE, David J, GILL, William N
Published in Journal of the Electrochemical Society (01.09.2000)
Published in Journal of the Electrochemical Society (01.09.2000)
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Journal Article